P-Xylene

P-Xylene

SCHEMBL8467418

Cc1ccc(C)cc1.O=P(O)(Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.59

Full drug profile on Sugi Atlas →

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
SRC P12931 1/20 0.59
MEN1 O00255 5/20 0.58
KMT2A Q03164 5/20 0.58
LMNA P02545 2/20 0.58
CYP3A4 P08684 1/20 0.54
TSHR P16473 1/20 0.54
ALDH1A1 P00352 3/20 0.51
NPSR1 Q6W5P4 1/20 0.51
MAPT P10636 1/20 0.49
HCRTR1 O43613 1/20 0.47
L3MBTL1 Q9Y468 2/20 0.47
TDP1 Q9NUW8 1/20 0.47
HPGD P15428 2/20 0.46
KDM4E B2RXH2 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL218003 0.98 CYP3A4 (0.57) SRCMEN1KMT2ALMNACYP3A4
Toluene SCHEMBL26607511 0.96 SRC (0.59) SRCMEN1KMT2ALMNACYP3A4
Toluene SCHEMBL29116599 0.94 SRC (0.57) SRCMEN1KMT2ALMNACYP3A4
Toluene SCHEMBL28459052 0.94 TSHR (0.57) SRCMEN1KMT2ALMNACYP3A4
Toluene SCHEMBL29178514 0.92 SRC (0.55) SRCMEN1KMT2ALMNACYP3A4
Biphenyl SCHEMBL17782089 0.90 CYP3A4 (0.53) SRCMEN1KMT2ALMNACYP3A4
SCHEMBL31566395 0.90 SRC (0.57) SRCMEN1KMT2ALMNACYP3A4
SCHEMBL157866 0.89 TSHR (0.67) SRCMEN1KMT2ALMNACYP3A4
Benzene SCHEMBL11142811 0.89 SRC (0.73) SRCTSHRALDH1A1L3MBTL1TDP1
SCHEMBL37038 0.89 SRC (0.73) SRCTSHRALDH1A1L3MBTL1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108485591-B Halogen-free flame-retardant low-volatility unsaturated resin composition and application thereof 四川东材科技集团股份有限公司 2021-03-16 CN claimed
CN-108081709-B Low-dielectric-loss and low-dielectric-loss glass fiber copper-clad plate and preparation method thereof 四川东材科技集团股份有限公司 2020-06-30 CN claimed
EP-4215568-B1 COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT DAIKIN IND LTD (JP) 2025-11-26 EP disclosed
EP-4641591-A1 FOAM MOLDING COMPOSITION, FOAM-MOLDED BODY, FOAMED ELECTRIC WIRE, MANUFACTURING METHOD FOR FOAM-MOLDED BODY, MANUFACTURING METHOD FOR ELECTRIC WIRE, AND IN-VEHICLE NETWORK CABLE Daikin Industries, Ltd. (JP) 2025-10-29 EP disclosed
US-20250316404-A1 FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, FOAMED ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY, METHOD FOR PRODUCING ELECTRIC WIRE AND IN-VEHICLE NETWORK CABLE DAIKIN INDUSTRIES, LTD. (JP) 2025-10-09 US disclosed
EP-4570853-A2 FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE DAIKIN INDUSTRIES, LTD. (JP) 2025-06-18 EP disclosed
CN-114269832-B Thermally expansive refractory material 积水化学工业株式会社 2024-07-23 CN disclosed
CN-117062876-A Resin composition for low dielectric material, film for laminated substrate, method for producing resin composition for low dielectric material, method for producing film for laminated substrate, and method for producing laminated substrate 国立大学法人岩手大学 2023-11-14 CN disclosed
CN-115279857-B Adhesive composition, and cover film and printed circuit board comprising same 株式会社斗山 2023-10-10 CN disclosed
US-20230242771-A1 COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT DAIKIN INDUSTRIES, LTD. (JP) 2023-08-03 US disclosed
US-20230235182-A1 POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE DAIKIN INDUSTRIES, LTD. (JP) 2023-07-27 US disclosed
CN-108485591-B Halogen-free flame-retardant low-volatility unsaturated resin composition and application thereof 四川东材科技集团股份有限公司 2021-03-16 CN disclosed
CN-108081709-B Low-dielectric-loss and low-dielectric-loss glass fiber copper-clad plate and preparation method thereof 四川东材科技集团股份有限公司 2020-06-30 CN disclosed
CN-109776277-A A method of from extraction phenolic substances in feedstock oil containing phenol 湘潭大学 2019-05-21 CN disclosed
CN-108384493-A It is a kind of high to hold viscous floor glue and application 如皋市嘉好热熔胶有限公司 2018-08-10 CN disclosed
US-5936048-A Method for preparing modified resins and their applications MITSUI CHEMICALS, INC. (JP) 1999-08-10 US disclosed
EP-0698620-B1 Method for preparing modified resins and their applications MITSUI CHEMICALS INC (JP) 1998-12-09 EP disclosed
US-5792814-A REACTING A RESIN WITH A 5-((4,6-DIAMINO-S-TRIAZIN-2-YL)-NORBORN-2-ENE AND REACTING WITH AN EPOXIDE; FIREPROOFING; MOLDING MATERIALS MITSUI CHEMICALS, INC. (JP) 1998-08-11 US disclosed
US-5674947-A HEATING RESIN WITH FUNCTIONALIZED NORBORNENE COMPOUND IN ABSENCE OF REACTION CATALYST OR INITIATOR MITSUI TOATSU CHEMICALS, INC. (JP) 1997-10-07 US disclosed
EP-0698620-A1 Method for preparing modified resins and their applications MITSUI TOATSU CHEMICALS, Inc. (JP) 1996-02-28 EP disclosed