SCHEMBL8470299

SCHEMBL8470299

COc1ccc2c(c1)NCO2

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SNCA P37840 1/20 0.42
NOX1 Q9Y5S8 1/20 0.40
ALDH1A1 P00352 4/20 0.40
MAPT P10636 4/20 0.40
GAA P10253 2/20 0.40
HSD17B10 Q99714 2/20 0.40
MAOA P21397 1/20 0.39
MAOB P27338 1/20 0.39
PDE3B Q13370 1/20 0.39
PDE3A Q14432 1/20 0.39
KDM4E B2RXH2 3/20 0.39
NPC1 O15118 1/20 0.39
HPGD P15428 1/20 0.39
ALOX12 P18054 1/20 0.39
RAB9A P51151 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
HTR7 P34969 1/20 0.38
HTR2B P41595 1/20 0.38
TMEM97 Q5BJF2 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7196340 0.85 SNCA (0.46) SNCANOX1ALDH1A1MAPTGAA
SCHEMBL1513451 0.82 ALDH1A1 (0.62) ALDH1A1MAPTGAAHSD17B10PDE3B
SCHEMBL31452931 0.82 ALDH1A1 (0.62) ALDH1A1MAPTGAAHSD17B10PDE3B
SCHEMBL8471390 0.81 NQO1 (0.42) ALDH1A1MAPTGAAHSD17B10KDM4E
SCHEMBL22660257 0.80 ALDH1A1 (0.50) ALDH1A1MAPTGAAHSD17B10PDE3B
SCHEMBL8348569 0.75 HSD17B10 (0.67) ALDH1A1MAPTGAAHSD17B10HPGD
SCHEMBL12316529 0.73 CYP19A1 (0.49) ALDH1A1MAPTMAOBKDM4ENPC1
SCHEMBL11862421 0.73 CYP19A1 (0.42) SNCAMAPTTDP1HTR7HTR2B
SCHEMBL705600 0.73 MAPT (0.64) ALDH1A1MAPTGAAKDM4ENPC1
SCHEMBL13406446 0.71 KCNH2 (0.50) ALDH1A1MAPTGAAMAOBPDE3B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10113049-B2 Thermoplastic resin composition NIPPON NYUKAZAI CO., LTD. (JP) 2018-10-30 US disclosed
US-20150329698-A1 THERMOPLASTIC RESIN COMPOSITION NIPPON NYUKAZAI CO., LTD. (JP) 2015-11-19 US disclosed
US-5968725-A MATERIAL COMPRISING ON SUPPORT SILVER HALIDE PHOTOSENSITIVE LAYER CONTAINING ORGANIC SILVER SALT, REDUCING AGENT, ULTRAHIGH CONTRAST PROMOTING AGENT, SELECTED HETEROCYCLIC MERCAPTO COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1999-10-19 US disclosed
US-5236807-A Negative, hydrazine compound FUJI PHOTO FILM CO., LTD. (JP) 1993-08-17 US disclosed
US-4769316-A Method for restraining the formation of re-reversal negative image in direct positive silver halide photographic materials FUJI PHOTO FILM CO., LTD. (JP) 1988-09-06 US disclosed