SCHEMBL8505294

SCHEMBL8505294

NN(c1ccccc1)N(N)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.46
MAPT P10636 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
CYP3A4 P08684 2/20 0.46
KDM4E B2RXH2 1/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2D6 P10635 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
ALOX15 P16050 2/20 0.41
NPSR1 Q6W5P4 1/20 0.41
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
HTT P42858 2/20 0.39
TSHR P16473 1/20 0.39
AOC3 Q16853 3/20 0.38
HPGD P15428 2/20 0.36
GAA P10253 1/20 0.36
HSP90AA1 P07900 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10608193 0.82 MEN1 (0.44) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
SCHEMBL193916 0.79 ALDH1A1 (0.46) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
SCHEMBL1792016 0.79 ALDH1A1 (0.46) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
SCHEMBL898050 0.79
Ammonia Solution, Strong SCHEMBL28763213 0.76 ALDH1A1 (0.43) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
Hydrochloric Acid SCHEMBL250009 0.76 ALDH1A1 (0.43) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
Ammonia Solution, Strong SCHEMBL28873134 0.76 ALDH1A1 (0.43) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
Water SCHEMBL8817645 0.76 ALDH1A1 (0.43) ALDH1A1MAPTL3MBTL1CYP3A4KDM4E
SCHEMBL8809524 0.73
SCHEMBL2399223 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5877270-A Water solvent extraction degreasing method and molded products produced therewith KABUSHIKI KAISHA KOMATSU SEISAKUSHO (JP) 1999-03-02 US disclosed
US-5854379-A Thermal decomposition degreasing method and molded products thereof KABUSHIKI KAISHA KOMATSU SEISAKUSHO (JP) 1998-12-29 US disclosed
EP-0809556-B1 BINDER FOR USE IN METAL POWDER INJECTION MOLDING AND DEBINDING METHOD BY THE USE OF THE SAME KOMATSU MFG CO LTD (JP) 1998-10-21 EP disclosed
EP-0809556-A1 BINDER FOR USE IN METAL POWDER INJECTION MOLDING AND DEBINDING METHOD BY THE USE OF THE SAME KOMATSU LTD. (JP) 1997-12-03 EP disclosed
US-5627258-A POLYAMIDES KABUSHIKI KAISHA KOMATSU SEISAKUSHO (JP) 1997-05-06 US disclosed
WO-1996025261-A1 BINDER FOR USE IN METAL POWDER INJECTION MOLDING AND DEBINDING METHOD BY THE USE OF THE SAME KOMATSU LTD. (JP) 1996-08-22 WO disclosed