SCHEMBL8523312

SCHEMBL8523312

CCc1c(N)cc(C)c(N)c1CC

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.40
CYP3A4 P08684 3/20 0.40
TSHR P16473 3/20 0.40
TDP1 Q9NUW8 3/20 0.40
MAPK1 P28482 1/20 0.40
TP53 P04637 1/20 0.40
NOS3 P29474 3/20 0.38
NOS2 P35228 3/20 0.38
CD44 P16070 2/20 0.36
MAPT P10636 1/20 0.35
HTT P42858 1/20 0.35
KDM4E B2RXH2 2/20 0.35
POLB P06746 2/20 0.34
CYP1A2 P05177 1/20 0.33
ALOX15 P16050 1/20 0.33
CASP7 P55210 1/20 0.33
HIF1A Q16665 1/20 0.33
HSD17B10 Q99714 1/20 0.33
NOS1 P29475 1/20 0.33
S100B P04271 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29568662 1.00 ALDH1A1 (0.40) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL27705440 0.84 ALDH1A1 (0.41) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL28210094 0.84 ALDH1A1 (0.39) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL342202 0.82 ALDH1A1 (0.46) ALDH1A1CYP3A4TSHRTDP1MAPK1
Hydrochloric Acid SCHEMBL4663728 0.82 ALDH1A1 (0.40) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL30148082 0.81 CYP3A4 (0.40) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL238279 0.81 CYP3A4 (0.40) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL2306350 0.81 CYP3A4 (0.40) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL10594833 0.79 CYP3A4 (0.39) ALDH1A1CYP3A4TSHRTDP1MAPK1
SCHEMBL25162114 0.76 CYP3A4 (0.40) ALDH1A1CYP3A4TSHRTDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
CN-108389512-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-04-15 CN disclosed
CN-108387954-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-01-18 CN disclosed
US-10954340-B2 Polyimide precursor composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-23 US disclosed
CN-107922733-B Polyimide precursor composition 东京应化工业株式会社 2020-09-11 CN disclosed
CN-110249004-A Polyimide precursor composition 东京应化工业株式会社 2019-09-17 CN disclosed
EP-3330320-B1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-04-24 EP disclosed
US-20180223045-A1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-08-09 US disclosed
EP-3330320-A1 POLYIMIDE PRECURSOR COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-06-06 EP disclosed
CN-104769021-A Substrate for flexible device, flexible device and method for producing same, laminate and method for producing same, and resin composition ASAHI KASEI E MATERIALS CORP 2015-07-08 CN disclosed
EP-0915912-A1 CURABLE POLYMER COMPOSITIONS AND THEIR PREPARATION International Coatings Limited (GB) 1999-05-19 EP disclosed
WO-1998004594-A1 CURABLE POLYMER COMPOSITIONS AND THEIR PREPARATION INTERNATIONAL COATINGS LIMITED (GB) 1998-02-05 WO disclosed
US-5229485-A From pyromellitic acid and aromatic diamine, optionally terminated with aminophenol or allylnadic acid; tougheners CIBA-GEIGY CORPORATION (US) 1993-07-20 US disclosed