SCHEMBL8523558

SCHEMBL8523558

[C]1CCCCC1c1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
ALDH1A1 P00352 2/20 0.39
GAA P10253 1/20 0.39
SLC18A3 Q16572 6/20 0.39
SIGMAR1 Q99720 2/20 0.39
CYP2D6 P10635 2/20 0.37
TSHR P16473 2/20 0.37
SMN1; SMN2 Q16637 2/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2C9 P11712 1/20 0.37
APEX1 P27695 1/20 0.36
BLM P54132 1/20 0.36
NOS1 P29475 1/20 0.35
NOS2 P35228 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8362511 0.79 MEN1 (0.38) MEN1KMT2AALDH1A1GAASLC18A3
SCHEMBL8358194 0.78 SLC18A3 (0.37) MEN1KMT2AALDH1A1GAASLC18A3
SCHEMBL8359813 0.78 SLC18A3 (0.37) MEN1KMT2AALDH1A1GAASLC18A3
SCHEMBL8360446 0.78 SLC18A3 (0.37) MEN1KMT2AALDH1A1GAASLC18A3
SCHEMBL8356125 0.78 SLC18A3 (0.37) MEN1KMT2AALDH1A1GAASLC18A3
SCHEMBL8360449 0.78 SLC18A3 (0.37) MEN1KMT2AALDH1A1GAASLC18A3
SCHEMBL1533239 0.72 ALDH1A1 (0.34) ALDH1A1GAASLC18A3SIGMAR1CYP2D6
SCHEMBL14762408 0.71
SCHEMBL3232659 0.71
SCHEMBL7351610 0.69 ALDH1A1 (0.40) MEN1KMT2AALDH1A1GAASLC18A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-11349946-A None JP disclosed
WO-2024071129-A1 ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND BUILD-UP FILM 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
US-11807711-B2 Phenoxy resin, resin composition including same, cured object obtained therefrom, and production method therefor NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-11-07 US disclosed
US-20230097650-A1 ACTIVE ESTER RESIN, METHOD FOR PRODUCING THEREOF, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND MATERIAL FOR CIRCUIT SUBSTRATE NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-03-30 US disclosed
CN-115135692-A Active ester resin, epoxy resin composition, cured product thereof, prepreg, laminate, and deposited film 日铁化学材料株式会社 2022-09-30 CN disclosed
WO-2020129727-A1 PHENOXY RESIN, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT OBTAINED THEREFROM, AND PRODUCTION METHOD THEREFOR 日鉄ケミカル&マテリアル株式会社 2020-06-25 WO disclosed
JP-H11349946-A NEMATIC LIQUID CRYSTAL COMPOSITION AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SAME SAMSUNG DISPLAY DEVICES CO LTD 1999-12-21 JP disclosed
EP-0562809-A1 Photoconductive imaging members with fluorinated polycarbonates XEROX CORPORATION (US) 1993-09-29 EP disclosed
US-5242774-A Wear resistant multilayer elements with photogenerating layer and charge transport layer XEROX CORPORATION (US) 1993-09-07 US disclosed