SCHEMBL8528773

SCHEMBL8528773

[Pd].[Ti].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL37292 1.00
SCHEMBL5440409 0.82
SCHEMBL22204316 0.82
SCHEMBL1359261 0.82
SCHEMBL8528784 0.82
SCHEMBL23736416 0.82
SCHEMBL8436456 0.82
Water SCHEMBL20854771 0.82
Water SCHEMBL6895962 0.82
SCHEMBL25662 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3387420-B1 SENSING SYSTEM COMPRISING A NANOSTRUCTURE TRANSISTOR AND CORRESPONDING SENSING METHOD UNIV RAMOT (IL) 2023-11-15 EP disclosed
CN-116445696-A Titanium substrate preparation method capable of shortening titanium electrode preparation process 西安泰金新能科技股份有限公司 2023-07-18 CN disclosed
US-10636832-B2 System and method for sensing light RAMOT AT TEL-AVIV UNIVERSITY LTD. (IL) 2020-04-28 US disclosed
EP-3387420-A1 METHOD AND SYSTEM FOR SENSING Ramot at Tel-Aviv University Ltd. (IL) 2018-10-17 EP disclosed
CN-105886983-B A kind of rolling production method of titanium palldium alloy 洛阳双瑞精铸钛业有限公司 2017-11-03 CN disclosed
US-20170243911-A1 SYSTEM AND METHOD FOR SENSING LIGHT RAMOT AT TEL-AVIV UNIVERSITY LTD. (IL) 2017-08-24 US disclosed
WO-2017098518-A1 METHOD AND SYSTEM FOR SENSING RAMOT AT TEL-AVIV UNIVERSITY LTD. (IL) 2017-06-15 WO disclosed
CN-105886983-A Roll type production method of titanium and palladium alloy 洛阳双瑞精铸钛业有限公司 2016-08-24 CN disclosed
EP-0608603-B1 Copper-based metallization for hybrid integrated circuits AT & T CORP (US) 1998-12-30 EP disclosed
US-5356526-A Including a titanium/palladium alloy layer AT&T BELL LABORATORIES (US) 1994-10-18 US disclosed
EP-0608603-A1 Improved copper-based metallizations for hybrid integrated circuits AT&T Corp. (US) 1994-08-03 EP disclosed
US-5288951-A Composite titanium, titanium-palladium alloy, copper, nickel and gold films; aloy layer is hydrofluoric acid etchable AT&T BELL LABORATORIES (US) 1994-02-22 US disclosed