SCHEMBL8528784

SCHEMBL8528784

[Cu].[Pd].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4236811 0.87
SCHEMBL28047323 0.87
SCHEMBL5573272 0.82
SCHEMBL7576823 0.82
SCHEMBL6048097 0.82
SCHEMBL37292 0.82
SCHEMBL8528773 0.82
SCHEMBL1883443 0.82
SCHEMBL79664 0.82
SCHEMBL28103093 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102010091-B Advanced treatment method of sewage BEIJING ORIGIN WATER TECHNOLOGY CO 2012-01-18 CN claimed
CN-102010091-A Advanced treatment method of sewage BEIJING ORIGIN WATER TECHNOLOGY CO 2011-04-13 CN claimed
CN-117443444-A Copper-containing composite film comprising titanium-silicon molecular sieve layer, preparation method thereof and application thereof in preparation of propylene oxide 中国石油化工股份有限公司 2024-01-26 CN disclosed
US-10779403-B2 Shorting pattern between pads of a camera module APPLE INC. (US) 2020-09-15 US disclosed
US-20200100359-A1 Shorting Pattern between Pads of a Camera Module APPLE INC. 2020-03-26 US disclosed
CN-102010091-B Advanced treatment method of sewage BEIJING ORIGIN WATER TECHNOLOGY CO 2012-01-18 CN disclosed
CN-102010091-A Advanced treatment method of sewage BEIJING ORIGIN WATER TECHNOLOGY CO 2011-04-13 CN disclosed
EP-0608603-B1 Copper-based metallization for hybrid integrated circuits AT & T CORP (US) 1998-12-30 EP disclosed
EP-0776051-A2 Structure and fabrication process for an aluminum alloy junction self-aligned back contact silicon solar cell EBARA SOLAR INC (US) 1997-05-28 EP disclosed
US-5356526-A Including a titanium/palladium alloy layer AT&T BELL LABORATORIES (US) 1994-10-18 US disclosed
EP-0608603-A1 Improved copper-based metallizations for hybrid integrated circuits AT&T Corp. (US) 1994-08-03 EP disclosed
US-5288951-A Composite titanium, titanium-palladium alloy, copper, nickel and gold films; aloy layer is hydrofluoric acid etchable AT&T BELL LABORATORIES (US) 1994-02-22 US disclosed