Bromide

Bromide

SCHEMBL8534627

Br.CCc1nc(C)c[nH]1

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3APH1AAPH1BCHRM2CHRM3EZH2GRIN2AHTR1AHTR1BHTR1DHTR1FHTR3ANCSTNP2RY12PSEN1PSEN2PSENENSIGMAR1SLC6A2SLC6A3SLC6A4

The experimentally established mechanism targets of Bromide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17688 0.98
SCHEMBL28138740 0.98 ADORA1 (0.38)
SCHEMBL11333696 0.95
SCHEMBL11854680 0.95
SCHEMBL27353369 0.95
Water SCHEMBL28756842 0.95
Hydrochloric Acid SCHEMBL27901170 0.95
Ammonia Solution, Strong SCHEMBL28173798 0.95
Water SCHEMBL28740273 0.93 ADORA1 (0.36)
Water SCHEMBL28740272 0.93 ADORA1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-215999319-U Clamping equipment welded by vehicle type for designing front floor and rear floor of cabin 天津智予天成科技有限公司 2022-03-11 CN disclosed
WO-2014147072-A1 POTTING MASS, USE OF THE POTTING MASS, AND THERMALLY CURED COMPOSITE OBTAINABLE FROM THE POTTING MASS SIEMENS AKTIENGESELLSCHAFT (DE) 2014-09-25 WO disclosed
CN-103044264-A Method for preparing quaternary ammonium salt ZHAO LIDI 2013-04-17 CN disclosed
EP-0408990-B1 Thermosetting reaction resin mixture SIEMENS AG (DE) 1998-03-11 EP disclosed
US-5036135-A Comprising a phosphorus-free diepoxide, an epoxy-group-contai ning phosphorus compound, a diisocyanate, a curing catalyst an d filler; nonflammable molding materials SIEMENS AKTIENGESELLSCHAFT (DE) 1991-07-30 US disclosed
EP-0129787-B1 PROCESS FOR THE PRODUCTION OF MOULDING COMPOUNDS SIEMENS AKTIENGESELLSCHAFT (DE) 1991-05-02 EP disclosed
EP-0408990-A2 Thermosetting reaction resin mixture SIEMENS AKTIENGESELLSCHAFT (DE) 1991-01-23 EP disclosed
EP-0130454-B1 PROCESS FOR THE PREPARATION OF MOULDING MASSES FROM REACTIVE RESINS SIEMENS AKTIENGESELLSCHAFT (DE) 1989-11-08 EP disclosed
EP-0129800-B1 HEAT-CURABLE REACTION RESIN COMPOSITION SIEMENS AKTIENGESELLSCHAFT (DE) 1989-10-18 EP disclosed
US-4631306-A POLYURETHANES FROM POLYEPOXIDES AND POLYISOCYANATES SIEMENS AKTIENGESELLSCHAFT (DE) 1986-12-23 US disclosed
US-4582723-A BLEND OF POLYFUNCTIONAL EPOXIDE AND POLYFUNCTIONAL ISOCYANATE SIEMENS AKTIENGESELLSCHAFT (DE) 1986-04-15 US disclosed
US-4564651-A POLYMERS WITH OXAZOLIDINONE AND ISOCYANURATE RINGS FROM EPOXIDES AND ISOCYANATES SIEMENS AKTIENGESELLSCHAFT (DE) 1986-01-14 US disclosed
US-4562227-A Heat-hardenable reaction resin mixtures comprising polyfunctional epoxide, polyisocyanate prepolymer and a reaction accelerator which is either a tertiary amine or an imidazole SIEMENS AKTIENGESELLSCHAFT (DE) 1985-12-31 US disclosed
EP-0130454-A2 Process for the preparation of moulding masses from reactive resins SIEMENS AKTIENGESELLSCHAFT (DE) 1985-01-09 EP disclosed
EP-0129800-A2 Heat-curable reaction resin composition SIEMENS AKTIENGESELLSCHAFT (DE) 1985-01-02 EP disclosed
EP-0129787-A2 Process for the production of moulding compounds SIEMENS AKTIENGESELLSCHAFT (DE) 1985-01-02 EP disclosed