SCHEMBL17688

SCHEMBL17688

CCc1nc(C)c[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28138740 1.00 ADORA1 (0.38)
SCHEMBL11333696 0.98
Ammonia Solution, Strong SCHEMBL28173798 0.98
Bromide SCHEMBL8534627 0.98
SCHEMBL11854680 0.98
Hydrochloric Acid SCHEMBL27901170 0.98
SCHEMBL27353369 0.98
Hydrochloric Acid SCHEMBL28270521 0.95 ADORA1 (0.36)
Hydrogen Peroxide SCHEMBL28136903 0.95 ADORA1 (0.36)
SCHEMBL6757150 0.93 ADORA1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 41989 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122080468-A Preparation method of novel ultra-high voltage high-performance composite insulating material 2026-05-26 CN claimed
CN-122080827-A Adhesive film composition for reworking backing plate and preparation method thereof 2026-05-26 CN claimed
CN-122081917-A Low-temperature quick-setting self-repairing chromium-free passivation solution and preparation method and application thereof 2026-05-26 CN claimed
CN-122080829-A Single-component toughened heat-conducting epoxy resin adhesive film and preparation method thereof 2026-05-26 CN claimed
CN-117143315-B Composition containing polyalkenyl and used for DCPD epoxy resin and copper-clad plate and preparation method thereof JIANGSU DONGCAI NEW MATERIALS Co.,Ltd. (CN) 2026-05-26 CN claimed
CN-122080895-A Polyglycolic acid composition and preparation method thereof, biodegradable polyester material and application thereof, and PGA temporary plugging ball and preparation method thereof 2026-05-26 CN claimed
CN-122080832-A Low-viscosity high-permeability epoxy resin adhesive and preparation method and application thereof 2026-05-26 CN claimed
CN-122091384-A Preparation method of high-temperature magnetic slurry capable of being molded at low pressure for inductor 2026-05-26 CN claimed
CN-122080887-A Underground autonomous net-forming plugging agent and preparation method and application thereof 2026-05-26 CN claimed
CN-122094536-A Low-loss high-frequency carrier plate and manufacturing method thereof 2026-05-26 CN claimed
US-4128598-A POLYMERIZATION PRODUCT OF A BISMALEIMIDE AND AN AMINOPHENOL TOSHIBA CHEMICAL PRODUCTS CO. LTD. (JP) 1978-12-05 US claimed
US-4119592-A Rubbery bladders from epoxy compositions THE B. F. GOODRICH COMPANY (US) 1978-10-10 US claimed
US-4110364-A AND BISMALEIIMIDES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1978-08-29 US claimed
US-4107098-A HALOMETHYOXIRANE IS REACTED WITH AN IMIDAZOLE COMPOUND-PRODUCT REACTED WITH POLYFUNCTIONAL EPOXY COMPOUND MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1978-08-15 US claimed
US-4054728-A Sodium-sulfur batteries BELL TELEPHONE LABORATORIES, INCORPORATED (US) 1977-10-18 US claimed
US-4050608-A Cross-shaped joint cover member for generally rectangular composite insulating panels forming wall portion of insulated cryogenic liquid container OWENS-CORNING FIBERGLAS CORPORATION (US) 1977-09-27 US claimed
US-4041007-A WITH AN AROMATIC AMINE CURING AGENT, A CLAY FILLER, AND AN IMIDAZOLE RETARDING AGENT TO EXTEND SHELF LIFE YOUNGSTOWN SHEET AND TUBE COMPANY (US) 1977-08-09 US claimed
US-3989610-A ADHESIVES, PAINTS, PRINTED CIRCUITS, PLASTIC RELIEFS HITACHI CHEMICAL COMPANY, LTD. (JA) 1976-11-02 US claimed
US-3954712-A Hot-curable mixtures based on epoxide resin CIBA-GEIGY CORPORATION (US) 1976-05-04 US claimed
US-3947395-A Epoxy surface coating compositions HITACHI, LTD. (JA) 1976-03-30 US claimed