SCHEMBL854138

SCHEMBL854138

CCCCCOCC(O[SiH3])OCCCCC

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
USP2 O75604 1/20 0.44
LPAR1 Q92633 7/20 0.44
LPAR3 Q9UBY5 7/20 0.44
LPAR2 Q9HBW0 4/20 0.44
HTT P42858 2/20 0.43
PLA2G2C Q5R387 2/20 0.40
SPHK1 Q9NYA1 1/20 0.40
PRKD3 O94806 1/20 0.39
PRKCG P05129 1/20 0.39
PRKCB P05771 1/20 0.39
PRKCA P17252 1/20 0.39
PRKCH P24723 1/20 0.39
PRKCI P41743 1/20 0.39
PRKCE Q02156 1/20 0.39
PRKCQ Q04759 1/20 0.39
PRKCZ Q05513 1/20 0.39
PRKCD Q05655 1/20 0.39
PRKD1 Q15139 1/20 0.39
DNM1 Q05193 1/20 0.38
TLR2 O60603 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15414996 0.94 LPAR1 (0.38) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL3322208 0.82 HTT (0.39) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL14958388 0.82 USP2 (0.55) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL2115602 0.81 HSD17B10 (0.43) USP2HTT
SCHEMBL16496856 0.81 DNM1 (0.42) LPAR1LPAR3LPAR2DNM1
SCHEMBL5746522 0.81 HTT (0.42) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL9502490 0.81 TSHR (0.42) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL28458040 0.80 USP2 (0.48) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL28729471 0.80 USP2 (0.44) USP2LPAR1LPAR3LPAR2HTT
SCHEMBL11695842 0.79 LPAR6 (0.33) LPAR1LPAR3LPAR2DNM1LPAR5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
EP-3971229-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-23 EP disclosed
EP-2471841-A1 ORGANIC SILICONE PARTICLES, METHOD OF PRODUCING ORGANIC SILICONE PARTICLES, AND COSMETIC, RESIN COMPOSITION AND COATING COMPOSITION CONTAINING ORGANIC SILICONE PARTICLES Takemoto Yushi Kabushiki Kaisha (JP) 2012-07-04 EP disclosed
EP-2472655-A1 Negative electrode base member Tokyo Ohka Kogyo Co., Ltd. (JP) 2012-07-04 EP disclosed
EP-2433979-A1 IRREGULAR-SHAPED HOLLOW MICROPARTICLE, METHOD FOR PRODUCING SAME, AND COSMETIC MATERIAL AND RESIN COMPOSITION CONTAINING IRREGULAR-SHAPED HOLLOW MICROPARTICLE Takemoto Yushi Kabushiki Kaisha (JP) 2012-03-28 EP disclosed
US-20110224308-A1 ORGANOSILICONE FINE PARTICLES, METHOD OF PRODUCTION THEREOF AND COSMETIC MATERIALS, RESIN COMPOSITIONS AND PAINT COMPOSITIONS CONTAINING SAME TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 2011-09-15 US disclosed
US-20110171157-A1 NON-SPHERICAL FINE PARTICLES, METHOD OF PRODUCTION THEREOF AND COSMETIC MATERIALS AND RESIN COMPOSITIONS CONTAINING SAME ARATANI SATOSHI 2011-07-14 US disclosed
US-20110142893-A1 ORGANOSILICONE FINE PARTICLES, METHOD OF PRODUCING SAME, AND COSMETICS, RESIN COMPOSITIONS AND DEVELOPMENT TONERS CONTAINING SAME TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 2011-06-16 US disclosed
US-20110129672-A1 NON-SPHERICAL HOLLOW FINE PARTICLES, METHOD OF PRODUCTION THEREOF AND COSMETIC MATERIALS AND RESIN COMPOSITIONS CONTAINING SAME ARATANI SATOSHI 2011-06-02 US disclosed
US-20100119939-A1 NEGATIVE ELECTRODE BASE MEMBER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-05-13 US disclosed
EP-2131423-A1 NEGATIVE ELECTRODE BASE MEMBER Tokyo Ohka Kogyo Co., Ltd. (JP) 2009-12-09 EP disclosed
US-20080318165-A1 Composition For Forming Antireflective Film And Wiring Forming Method Using Same TOKYO OHKA KOGYO CO., LTD. (JP) 2008-12-25 US disclosed