Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL275706 | 0.74 | — | — | |
| SCHEMBL30565433 | 0.74 | TSHR (0.30) | TSHRSMN1; SMN2 | |
| SCHEMBL10815788 | 0.74 | TSHR (0.31) | TSHRSMN1; SMN2 | |
| SCHEMBL22791284 | 0.72 | — | — | |
| SCHEMBL14243958 | 0.69 | TSHR (0.30) | TSHRSMN1; SMN2 | |
| SCHEMBL6511785 | 0.69 | TSHR (0.30) | TSHRSMN1; SMN2 | |
| SCHEMBL8816244 | 0.64 | FDPS (0.32) | TSHRSMN1; SMN2 | |
| SCHEMBL22328095 | 0.64 | — | — | |
| SCHEMBL14231343 | 0.60 | — | — | |
| 2-Methylbutanal SCHEMBL4507667 | 0.59 | TSHR (0.41) | TSHRSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7842382-B2 | formaldehyde-free, thermally-curable, alkaline, aqueous binders, curable to water insoluble thermoset polyester resins, used for binding non-woven fibers | KNAUF INSULATION GMBH (US) | 2010-11-30 | — | — | US | claimed |
| US-4576990-A | Water-soluble insulating varnish | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1986-03-18 | — | — | US | claimed |
| US-20240150496-A1 | BINDER COMPOSITIONS AND USES THEREOF | KNAUF INSULATION, INC. | 2024-05-09 | — | — | US | disclosed |
| US-20240141172-A1 | Composite Wood Board | KNAUF INSULATION SPRL (BE) | 2024-05-02 | — | — | US | disclosed |
| US-20240117214-A1 | BINDERS AND MATERIALS MADE THEREWITH | KNAUF INSULATION INC (US) | 2024-04-11 | — | — | US | disclosed |
| US-11945883-B2 | Binder compositions and uses thereof | KNAUF INSULATION SPRL (BE) | 2024-04-02 | — | — | US | disclosed |
| US-20240059897-A1 | Composite Wood Board | KNAUF INSULATION SPRL (BE) | 2024-02-22 | — | — | US | disclosed |
| US-11905206-B2 | Binders and materials made therewith | KNAUF INSULATION, INC. (US) | 2024-02-20 | — | — | US | disclosed |
| US-20240034904-A1 | BINDERS AND MATERIALS MADE THEREWITH | KNAUF INSULATION INC (US) | 2024-02-01 | — | — | US | disclosed |
| US-20230392016-A1 | Composite Wood Board | KNAUF INSULATION SPRL (BE) | 2023-12-07 | — | — | US | disclosed |
| EP-3368593-B1 | IMPROVED BINDER COMPOSITIONS AND USES THEREOF | KNAUF INSULATION SPRL (BE) | 2023-12-06 | — | — | EP | disclosed |
| US-20070123679-A1 | Binders and materials made therewith | KNAUF INSULATION, INC. | 2007-05-31 | — | — | US | disclosed |
| WO-2007060236-A1 | FORMALDEHYDE-FREE BINDER | SAINT-GOBAIN ISOVER (FR) | 2007-05-31 | — | — | WO | disclosed |
| US-20070123680-A1 | Binders and materials made therewith | KNAUF INSULATION, INC | 2007-05-31 | — | — | US | disclosed |
| WO-2007014236-A2 | BINDERS AND MATERIALS MADE THEREWITH | KNAUF INSULATION GMBH (US) | 2007-02-01 | — | — | WO | disclosed |
| US-20070027283-A1 | Binders and materials made therewith | KNAUF INSULATION, INC. | 2007-02-01 | — | — | US | disclosed |
| EP-1732968-A1 | BINDER COMPOSITIONS AND ASSOCIATED METHODS | Knauf Insulation GmbH (US) | 2006-12-20 | — | — | EP | disclosed |
| WO-2006044302-A1 | POLYESTER BINDING COMPOSITIONS | KNAUF INSULATION GMBH (US) | 2006-04-27 | — | — | WO | disclosed |
| WO-2005087837-A1 | BINDER COMPOSITIONS AND ASSOCIATED METHODS | KNAUF INSULATION GMBH (US) | 2005-09-22 | — | — | WO | disclosed |
| US-20050202224-A1 | formaldehyde-free, thermally-curable, alkaline, aqueous binders, curable to water insoluble thermoset polyester resins, used for binding non-woven fibers | KNAUF INSULATION, INC. | 2005-09-15 | — | — | US | disclosed |