SCHEMBL854470

SCHEMBL854470

CCC(C(=O)O)C(C(=O)O)(C(=O)O)C(=O)O.[HH].[HH]

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPD1 P10809 1/20 0.35
BLM P54132 1/20 0.35
HSPE1 P61604 1/20 0.35
HDAC1 Q13547 2/20 0.33
HDAC2 Q92769 2/20 0.33
CHRM1 P11229 1/20 0.33
AKR1A1 P14550 1/20 0.33
CHRM3 P20309 1/20 0.33
HTR2A P28223 1/20 0.33
HTR2C P28335 1/20 0.33
ADRA1A P35348 1/20 0.33
HRH1 P35367 1/20 0.33
DRD3 P35462 1/20 0.33
SLC6A3 Q01959 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
CA2 P00918 1/20 0.33
MAPK1 P28482 1/20 0.33
SLC1A3 P43003 1/20 0.32
SLC1A2 P43004 1/20 0.32
SLC1A1 P43005 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29174 0.97 HSPD1 (0.36) HSPD1BLMHSPE1HDAC1HDAC2
Water SCHEMBL28414388 0.95 HSPD1 (0.35) HSPD1BLMHSPE1HDAC1HDAC2
SCHEMBL11749741 0.95 HSPD1 (0.35) HSPD1BLMHSPE1HDAC1HDAC2
SCHEMBL28142494 0.95 HSPD1 (0.35) HSPD1BLMHSPE1HDAC1HDAC2
Ammonia Solution, Strong SCHEMBL11691037 0.95 HSPD1 (0.35) HSPD1BLMHSPE1HDAC1HDAC2
Hydrochloric Acid SCHEMBL19371317 0.95 HSPD1 (0.35) HSPD1BLMHSPE1HDAC1HDAC2
Water SCHEMBL4967126 0.95 HSPD1 (0.35) HSPD1BLMHSPE1HDAC1HDAC2
Ether SCHEMBL4967124 0.87 MEN1 (0.32) HSPD1BLMHSPE1MEN1KMT2A
SCHEMBL11690637 0.84 SLC1A3 (0.38) HSPD1BLMHSPE1HDAC1HDAC2
SCHEMBL3828652 0.82 PRSS1 (0.32) HSPD1BLMHSPE1FFAR3MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 217 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7842382-B2 formaldehyde-free, thermally-curable, alkaline, aqueous binders, curable to water insoluble thermoset polyester resins, used for binding non-woven fibers KNAUF INSULATION GMBH (US) 2010-11-30 US claimed
US-20240150496-A1 BINDER COMPOSITIONS AND USES THEREOF KNAUF INSULATION, INC. 2024-05-09 US disclosed
US-20240141172-A1 Composite Wood Board KNAUF INSULATION SPRL (BE) 2024-05-02 US disclosed
US-20240117214-A1 BINDERS AND MATERIALS MADE THEREWITH KNAUF INSULATION INC (US) 2024-04-11 US disclosed
US-11945883-B2 Binder compositions and uses thereof KNAUF INSULATION SPRL (BE) 2024-04-02 US disclosed
US-20240059897-A1 Composite Wood Board KNAUF INSULATION SPRL (BE) 2024-02-22 US disclosed
US-11905206-B2 Binders and materials made therewith KNAUF INSULATION, INC. (US) 2024-02-20 US disclosed
US-20240034904-A1 BINDERS AND MATERIALS MADE THEREWITH KNAUF INSULATION INC (US) 2024-02-01 US disclosed
US-20230392016-A1 Composite Wood Board KNAUF INSULATION SPRL (BE) 2023-12-07 US disclosed
EP-3368593-B1 IMPROVED BINDER COMPOSITIONS AND USES THEREOF KNAUF INSULATION SPRL (BE) 2023-12-06 EP disclosed
US-20070142596-A1 Binders and materials made therewith KNAUF INSULATION, INC. 2007-06-21 US disclosed
US-20070123679-A1 Binders and materials made therewith KNAUF INSULATION, INC. 2007-05-31 US disclosed
WO-2007060236-A1 FORMALDEHYDE-FREE BINDER SAINT-GOBAIN ISOVER (FR) 2007-05-31 WO disclosed
US-20070123680-A1 Binders and materials made therewith KNAUF INSULATION, INC 2007-05-31 US disclosed
WO-2007014236-A2 BINDERS AND MATERIALS MADE THEREWITH KNAUF INSULATION GMBH (US) 2007-02-01 WO disclosed
US-20070027283-A1 Binders and materials made therewith KNAUF INSULATION, INC. 2007-02-01 US disclosed
EP-1732968-A1 BINDER COMPOSITIONS AND ASSOCIATED METHODS Knauf Insulation GmbH (US) 2006-12-20 EP disclosed
WO-2006044302-A1 POLYESTER BINDING COMPOSITIONS KNAUF INSULATION GMBH (US) 2006-04-27 WO disclosed
WO-2005087837-A1 BINDER COMPOSITIONS AND ASSOCIATED METHODS KNAUF INSULATION GMBH (US) 2005-09-22 WO disclosed
US-20050202224-A1 formaldehyde-free, thermally-curable, alkaline, aqueous binders, curable to water insoluble thermoset polyester resins, used for binding non-woven fibers KNAUF INSULATION, INC. 2005-09-15 US disclosed