⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4458 | 0.96 | — | — | |
| Hydrochloric Acid SCHEMBL8681532 | 0.93 | — | — | |
| Water SCHEMBL6705186 | 0.93 | — | — | |
| Hydrochloric Acid SCHEMBL360708 | 0.93 | — | — | |
| Water SCHEMBL4239659 | 0.93 | HSP90AA1 (0.93) | — | |
| Formaldehyde SCHEMBL3745731 | 0.87 | — | — | |
| Boric Acid SCHEMBL8843854 | 0.84 | HSP90AA1 (0.77) | — | |
| SCHEMBL578041 | 0.84 | HSP90AA1 (0.77) | — | |
| SCHEMBL8156139 | 0.82 | HSP90AA1 (0.72) | — | |
| Carbamic Acid SCHEMBL5171984 | 0.80 | HSP90AA1 (0.68) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040226741-A1 | Package for electronic device, base substrate, electronic device and fabrication method thereof | TAIYO YUDEN CO., LTD. (JP) | 2004-11-18 | — | — | US | claimed |
| US-RE45419-E1 | Surface acoustic wave device and method of fabricating the same | TAIYO YUDEN CO., LTD. (JP) | 2015-03-17 | — | — | US | disclosed |
| EP-1471635-B1 | Surface acoustic wave device and method of fabricating the same | TAIYO YUDEN KK (JP) | 2012-03-28 | — | — | EP | disclosed |
| CN-100433551-C | Surface acoustic wave device and its mfg. method | FUJITSU MEDIA DEVICES LTD (JP) | 2008-11-12 | — | — | CN | disclosed |
| US-7304417-B2 | Package for electronic device, base substrate, electronic device and fabrication method thereof | FUJITSU MEDIA DEVICES LIMITED (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7227429-B2 | Surface acoustic wave device and method of fabricating the same | FUJITSU MEDIA DEVICES LIMITED (JP) | 2007-06-05 | — | — | US | disclosed |
| CN-1642004-A | Surface acoustic wave device | FUJITSU MEDIA DEVICES LTD (JP) | 2005-07-20 | — | — | CN | disclosed |
| US-20040226741-A1 | Package for electronic device, base substrate, electronic device and fabrication method thereof | TAIYO YUDEN CO., LTD. (JP) | 2004-11-18 | — | — | US | disclosed |
| EP-1471635-A2 | Surface acoustic wave device and method of fabricating the same | Fujitsu Media Devices Limited (JP) | 2004-10-27 | — | — | EP | disclosed |
| US-20040207485-A1 | Surface acoustic wave device and method of fabricating the same | TAIYO YUDEN CO., LTD. (JP) | 2004-10-21 | — | — | US | disclosed |
| CN-1534868-A | Srface acoustic wave device and its mfg. method | ��ʿͨý�岿Ʒ��ʽ���� | 2004-10-06 | — | — | CN | disclosed |
| CN-1534869-A | Surface acoustic wave device and its mfg. method | ��ʿͨý�岿Ʒ��ʽ���� | 2004-10-06 | — | — | CN | disclosed |
| US-20040189146-A1 | Surface acoustic wave device and method of fabricating the same | FUJITSU MEDIA DEVICES LIMITED | 2004-09-30 | — | — | US | disclosed |
| CN-1531199-A | Electronic component package, substrate, electronic components and manufacture thereof | ��ʿͨý�岿Ʒ��ʽ���� | 2004-09-22 | — | — | CN | disclosed |