⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8979044 | 0.78 | — | — | |
| SCHEMBL16963862 | 0.74 | — | — | |
| SCHEMBL9378664 | 0.72 | — | — | |
| SCHEMBL10724817 | 0.72 | MEN1 (0.38) | — | |
| SCHEMBL2335418 | 0.72 | CYP1A2 (0.37) | — | |
| SCHEMBL7872652 | 0.72 | CYP19A1 (0.30) | — | |
| SCHEMBL238491 | 0.71 | — | — | |
| SCHEMBL29082882 | 0.71 | — | — | |
| SCHEMBL29010804 | 0.71 | — | — | |
| SCHEMBL15914733 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117285882-A | Double-sided adhesive tape and electronic device | DIC株式会社 | 2023-12-26 | — | — | CN | disclosed |
| CN-113840887-B | Double-sided adhesive tape and electronic device | DIC株式会社 | 2023-10-10 | — | — | CN | disclosed |
| CN-112105699-B | Conductive adhesive sheet | DIC株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-113840887-A | Double-sided adhesive tape and electronic device | DIC株式会社 | 2021-12-24 | — | — | CN | disclosed |
| CN-112105699-A | Conductive adhesive sheet | DIC株式会社 | 2020-12-18 | — | — | CN | disclosed |
| US-10793755-B2 | Adhesive sheet and electronic device | DIC CORPORATION (JP) | 2020-10-06 | — | — | US | disclosed |
| CN-105462362-B | Ink composition, method for producing ink composition, and image forming method | 富士胶片株式会社 | 2020-07-14 | — | — | CN | disclosed |
| US-10470312-B2 | Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit | DIC Corporation (Tokyo) (JP) | 2019-11-05 | — | — | US | disclosed |
| US-9629253-B2 | Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component | DIC CORPORATION (JP) | 2017-04-18 | — | — | US | disclosed |
| US-20170015872-A1 | ADHESIVE SHEET AND ELECTRONIC DEVICE | DIC CORPORATION (JP) | 2017-01-19 | — | — | US | disclosed |
| US-20160007477-A1 | METHOD FOR FORMING ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, AND ELECTRIC CIRCUIT | DIC CORPORATION (JP) | 2016-01-07 | — | — | US | disclosed |
| US-20150289383-A1 | METHOD FOR FORMING HIGH-DEFINITION METAL PATTERN, HIGH-DEFINITION METAL PATTERN, AND ELECTRONIC COMPONENT | DIC CORPORATION (JP) | 2015-10-08 | — | — | US | disclosed |
| US-8829080-B2 | Coating agent and method for production thereof | DIC CORPORATION (JP) | 2014-09-09 | — | — | US | disclosed |
| EP-2221352-B1 | COATING AGENT AND METHOD FOR PRODUCTION THEREOF | DAINIPPON INK & CHEMICALS (JP) | 2012-03-28 | — | — | EP | disclosed |
| US-20100273930-A1 | COATING AGENT AND METHOD FOR PRODUCTION THEREOF | DIC CORPORATION (JP) | 2010-10-28 | — | — | US | disclosed |