⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7611041 | 0.77 | EPHX1 (0.30) | — | |
| SCHEMBL3624573 | 0.77 | — | — | |
| SCHEMBL28179852 | 0.74 | CYP2D6 (0.30) | — | |
| SCHEMBL2226760 | 0.74 | CYP19A1 (0.31) | — | |
| SCHEMBL4728219 | 0.74 | — | — | |
| SCHEMBL10881574 | 0.74 | CYP2D6 (0.30) | — | |
| SCHEMBL13892957 | 0.74 | EPHX1 (0.35) | — | |
| SCHEMBL3628479 | 0.73 | TSHR (0.30) | — | |
| SCHEMBL4681944 | 0.72 | SMN1; SMN2 (0.42) | — | |
| SCHEMBL20854885 | 0.72 | LMNA (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 239 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024014096-A1 | METHOD FOR PRODUCING POLYESTER RESIN MOLDED PRODUCT, AND MASTERBATCH | 東洋インキＳＣホールディングス株式会社 | 2024-01-18 | — | — | WO | disclosed |
| US-20230219358-A1 | HEAT TRANSFER SHEET AND COMBINATION OF HEAT TRANSFER SHEET AND INTERMEDIATE TRANSFER MEDIUM | DAI NIPPON PRINTING CO., LTD. (JP) | 2023-07-13 | — | — | US | disclosed |
| EP-4151424-A1 | HEAT TRANSFER SHEET, AND COMBINATION OF SAID HEAT TRANSFER SHEET AND INTERMEDIATE TRANSFER MEDIUM | Dai Nippon Printing Co., Ltd. (JP) | 2023-03-22 | — | — | EP | disclosed |
| WO-2023003028-A1 | THERMAL TRANSFER SHEET, METHOD FOR PRODUCING PRINTED MATTER, AND PRINTED MATTER | 大日本印刷株式会社 | 2023-01-26 | — | — | WO | disclosed |
| US-20230022367-A1 | PEEL-OFF SHEET, AND COMBINATION OF PEEL-OFF SHEET AND INTERMEDIATE TRANSFER MEDIUM | DAI NIPPON PRINTING CO., LTD. (JP) | 2023-01-26 | — | — | US | disclosed |
| US-20230004105-A1 | INTERMEDIATE TRANSFER MEDIUM, PRINTED MATERIAL, AND METHOD FOR PRODUCING PRINTED MATERIAL | DAI NIPPON PRINTING CO., LTD. (JP) | 2023-01-05 | — | — | US | disclosed |
| CN-115551718-A | Thermal transfer sheet, and combination of thermal transfer sheet and intermediate transfer medium | 大日本印刷株式会社 | 2022-12-30 | — | — | CN | disclosed |
| CN-114929485-A | Release sheet, and combination of the release sheet and intermediate transfer medium | 大日本印刷株式会社 | 2022-08-19 | — | — | CN | disclosed |
| US-20220153051-A1 | THERMAL TRANSFER SHEET | DAI NIPPON PRINTING CO., LTD. (JP) | 2022-05-19 | — | — | US | disclosed |
| CN-110945075-B | Polyester resin composition and method for producing same | 东丽株式会社 | 2022-03-25 | — | — | CN | disclosed |
| WO-2011087144-A1 | PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-07-21 | — | — | WO | disclosed |
| WO-2011083872-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-07-14 | — | — | WO | disclosed |
| US-20110091809-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2011-04-21 | — | — | US | disclosed |
| WO-2011043481-A1 | PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-04-14 | — | — | WO | disclosed |
| WO-2011024734-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2011-03-03 | — | — | WO | disclosed |
| US-20110008731-A1 | ACTINIC-RAY-OR RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2011-01-13 | — | — | US | disclosed |
| WO-2010140709-A1 | METHOD OF FORMING PATTERN USING ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, AND PATTERN | FUJIFILM CORPORATION (JP) | 2010-12-09 | — | — | WO | disclosed |
| US-20100255418-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN THEREWITH | FUJIFILM CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100248136-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2010-09-30 | — | — | US | disclosed |
| WO-2010061977-A2 | PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-06-03 | — | — | WO | disclosed |