SCHEMBL8587018

SCHEMBL8587018

CCCCC=C(C)C(=O)OCCCC

nearest known ligand 0.52

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.52
ATM Q13315 1/20 0.48
TSHR P16473 4/20 0.47
HPGD P15428 1/20 0.46
HCAR2 Q8TDS4 3/20 0.43
NAAA Q02083 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C19 P33261 1/20 0.38
NPSR1 Q6W5P4 2/20 0.38
MAPT P10636 1/20 0.38
RAB9A P51151 1/20 0.38
FAAH O00519 1/20 0.37
EP300 Q09472 1/20 0.37
RAD52 P43351 1/20 0.37
ESR1 P03372 1/20 0.37
EPHX1 P07099 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30612322 0.98 ALDH1A1 (0.50) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL28287034 0.98 ALDH1A1 (0.50) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL11146407 0.94 TSHR (0.55) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL11146406 0.94 TSHR (0.50) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL28542332 0.93 TSHR (0.53) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL1093905 0.93 TSHR (0.53) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL28107306 0.93 TSHR (0.58) ALDH1A1ATMTSHRHCAR2NAAA
SCHEMBL28523942 0.93 TSHR (0.53) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL1093902 0.93 TSHR (0.53) ALDH1A1ATMTSHRHPGDHCAR2
SCHEMBL27992887 0.93 TSHR (0.53) ALDH1A1ATMTSHRHPGDHCAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117659266-A Preparation method of ray-proof butyl methacrylate plate 锦西化工研究院有限公司 2024-03-08 CN claimed
CN-106746558-B Manufacturing method of 3D multi-dimensional cambered surface multilayer laminated glass substrate 江苏秀强玻璃工艺股份有限公司 2020-02-07 CN claimed
WO-2024128006-A1 RADICAL-POLYMERIZABLE COMPOSITION DIC株式会社 2024-06-20 WO disclosed
CN-117659266-A Preparation method of ray-proof butyl methacrylate plate 锦西化工研究院有限公司 2024-03-08 CN disclosed
CN-112479888-B Compound, polymer, patterning material, patterning method, and method for manufacturing semiconductor device 铠侠股份有限公司 2023-12-08 CN disclosed
CN-116854631-A 4-aryl-2-pyridone compound and preparation method thereof 安徽中医药大学 2023-10-10 CN disclosed
CN-111019035-B Styrene-butadiene latex for surface coating and preparation method and application thereof 上海东升新材料有限公司 2022-08-19 CN disclosed
CN-114249852-A Method for preparing monodisperse photoactive polymer microspheres 中山大学 2022-03-29 CN disclosed
WO-2020241822-A1 METHACRYLIC COPOLYMER AND MOLDED ARTICLE 株式会社クラレ 2020-12-03 WO disclosed
CN-106057651-B Method for forming patterns with different sizes 爱思开海力士有限公司 2020-08-14 CN disclosed
CN-111511819-A Foam compositions with improved properties and uses thereof 布拉斯科有限公司 2020-08-07 CN disclosed
CN-104191770-A Polyvinylidene fluoride composite membrane and preparation method thereof SHANGHAI HIUV NEW MATERIALS CO LTD 2014-12-10 CN disclosed
CN-1846988-B Gas barrier film and organic device using same FUJI PHOTO FILM CO LTD 2012-04-04 CN disclosed
CN-1315640-C Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article ATOFINA CORP (FR) 2007-05-16 CN disclosed
CN-1496818-A Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article ���з��ɹ�˾ 2004-05-19 CN disclosed
EP-0578091-B1 Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition CANON KK (JP) 1998-09-02 EP disclosed
CN-1159199-A Novel amphipathic graft copolymers, their prepn., compositions thereof and methods of their use DOW CHEMICAL CO (US) 1997-09-10 CN disclosed
US-5397401-A Mixtures of thermoplastic and thermosetting resins, styrene, acrylic ester polymers, solar cells CANON KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
EP-0578091-A2 Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition CANON KABUSHIKI KAISHA (JP) 1994-01-12 EP disclosed
US-4510181-A FORMING CORROSION PROTECTIVE LAYER ON SURFACE USING VINYL MONOMERS AND/OR VINLY GROUP CONTAINING OLIGOMER NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1985-04-09 US disclosed