SCHEMBL8601008

SCHEMBL8601008

C=CCNC(=S)C(N)=S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9819151 0.86 ALDH1A1 (0.62)
Allylthiourea SCHEMBL29372 0.81
Allylthiourea SCHEMBL28461431 0.79
Allylthiourea SCHEMBL28555320 0.79
Allylthiourea SCHEMBL29111187 0.79
Allylthiourea SCHEMBL29055951 0.79
Allylthiourea SCHEMBL30309853 0.79
Allylthiourea SCHEMBL10882505 0.79
Allylthiourea SCHEMBL8763252 0.79 ALDH1A1 (0.95)
SCHEMBL7155759 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1083871-C Epoxy Adhesives Containing Dithiooxamide Adhesion Promoters MINNESOTA MINING & MFG (US) 2002-05-01 CN disclosed
EP-0820492-B1 EPOXY ADHESIVES WITH DITHIOOXAMIDE ADHESION PROMOTERS MINNESOTA MINING & MFG (US) 1999-08-25 EP disclosed
CN-1180369-A Epoxy adhesives containing dithio * amide adhesion promoters MINNESOTA MINNG AND MANUFACTUR (US) 1998-04-29 CN disclosed
EP-0820492-A1 EPOXY ADHESIVES WITH DITHIOOXAMIDE ADHESION PROMOTERS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-01-28 EP disclosed
US-5712039-A AMINE CURED EPOXY ADHESIVES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-01-27 US disclosed
WO-1996032454-A1 EPOXY ADHESIVES WITH DITHIOOXAMIDE ADHESION PROMOTERS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-10-17 WO disclosed
EP-0434213-B1 Monosubstituted dithiooxamide compounds and their use MINNESOTA MINING & MFG (US) 1995-04-05 EP disclosed
EP-0310803-B1 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby GEN ELECTRIC (US) 1993-10-20 EP disclosed
US-5124308-A Reacts with transition metal salt for carbonless paper copying MINNESOTA MINING AND MANUFACTURING COMPANY 1992-06-23 US disclosed
EP-0434213-A1 Monosubstituted dithiooxamide compounds and their use MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1991-06-26 EP disclosed
US-4842946-A PRESURFACE TREATMENT WITH ADHESION PROMOTER; ELECTROLESS DEPOSITION GENERAL ELECTRIC COMPANY (US) 1989-06-27 US disclosed
EP-0310803-A1 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby GENERAL ELECTRIC COMPANY (US) 1989-04-12 EP disclosed
US-H563-H Use of sulfur-containing compounds for controlling plant parasitic nematodes RHONE POULENC NEDERLANDS B.V. (NL) 1989-01-03 US disclosed