Edetic Acid

Edetic Acid

SCHEMBL8611926

O=C(O)CN(CCN(CC(=O)O)CC(=O)O)CC(=O)O.OCCN(CCO)CCO.OCCN(CCO)CCO.OCCN(CCO)CCO.OCCN(CCO)CCO

nearest known ligand 0.74

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.74
EYA2 O00167 1/20 0.74
APP P05067 1/20 0.74
ACE P12821 1/20 0.74
ALOX15 P16050 3/20 0.70
KDM4E B2RXH2 2/20 0.70
BLM P54132 2/20 0.70
PMP22 Q01453 2/20 0.70
LMNA P02545 2/20 0.70
TSHR P16473 2/20 0.70
CYP2C19 P33261 2/20 0.70
CHRM2 P08172 1/20 0.70
ADRA2A P08913 1/20 0.70
DRD1 P21728 1/20 0.70
SLC6A2 P23975 1/20 0.70
SLC6A4 P31645 1/20 0.70
ADRA1A P35348 1/20 0.70
DRD3 P35462 1/20 0.70
SLC6A3 Q01959 1/20 0.70
HRH3 Q9Y5N1 1/20 0.70

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Edetic Acid SCHEMBL1006496 1.00 TDP1 (0.74) TDP1EYA2APPACEALOX15
Edetic Acid SCHEMBL10949095 1.00 TDP1 (0.74) TDP1EYA2APPACEALOX15
SCHEMBL25851254 1.00 TDP1 (0.74) TDP1EYA2APPACEALOX15
SCHEMBL5097424 1.00 TDP1 (0.74) TDP1EYA2APPACEALOX15
Hydrochloric Acid SCHEMBL9008883 0.97 TDP1 (0.70) TDP1EYA2APPACEALOX15
Edetic Acid SCHEMBL4015979 0.97 TDP1 (0.78) TDP1EYA2APPACEALOX15
SCHEMBL24758890 0.95 ALOX15 (0.79) TDP1EYA2APPACEALOX15
SCHEMBL143335 0.95 ALOX15 (0.79) TDP1EYA2APPACEALOX15
SCHEMBL8612236 0.95 ALOX15 (0.79) TDP1EYA2APPACEALOX15
Edetic Acid SCHEMBL1768177 0.95 ALOX15 (0.79) TDP1EYA2APPACEALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119776838-A Abrasive-free alkaline copper fine polishing liquid for integrated circuit copper wiring and preparation method thereof 江苏海洋大学 2025-04-08 CN claimed
CN-119776839-A Method for controlling surface concave-convex speed difference by adopting abrasive-free copper CMP polishing liquid 江苏海洋大学 2025-04-08 CN claimed
CN-119776839-A Method for controlling surface concave-convex speed difference by adopting abrasive-free copper CMP polishing liquid 江苏海洋大学 2025-04-08 CN disclosed
CN-119776838-A Abrasive-free alkaline copper fine polishing liquid for integrated circuit copper wiring and preparation method thereof 江苏海洋大学 2025-04-08 CN disclosed
US-5814245-A Fluorescent and cathodoluminescent phophors structurally related to sodalite SANDIA CORPORATION (US) 1998-09-29 US disclosed