Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.65 |
| ▸ | GLA | P06280 | 1/20 | 0.65 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.51 |
| ▸ | GAA | P10253 | 3/20 | 0.47 |
| ▸ | MAPT | P10636 | 3/20 | 0.47 |
| ▸ | JAK2 | O60674 | 1/20 | 0.47 |
| ▸ | LMNA | P02545 | 1/20 | 0.47 |
| ▸ | TP53 | P04637 | 4/20 | 0.46 |
| ▸ | TSHR | P16473 | 4/20 | 0.46 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.46 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.44 |
| ▸ | HTR1A | P08908 | 1/20 | 0.44 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.44 |
| ▸ | HTR2A | P28223 | 1/20 | 0.44 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.44 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.44 |
| ▸ | HTR2B | P41595 | 1/20 | 0.44 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethane SCHEMBL9175082 | 0.95 | ALDH1A1 (0.67) | ALDH1A1GLATDP1GAAMAPT | |
| SCHEMBL3858634 | 0.95 | ALDH1A1 (0.66) | ALDH1A1GLATDP1GAAMAPT | |
| SCHEMBL9170142 | 0.85 | ALDH1A1 (0.63) | ALDH1A1GLATDP1GAAMAPT | |
| Propane SCHEMBL28104053 | 0.83 | ALDH1A1 (0.93) | ALDH1A1GLATDP1MAPTTP53 | |
| SCHEMBL4388578 | 0.83 | ALDH1A1 (0.59) | ALDH1A1GLATDP1GAAMAPT | |
| SCHEMBL679937 | 0.82 | ALDH1A1 (0.78) | ALDH1A1GLATDP1GAAMAPT | |
| SCHEMBL22357196 | 0.82 | ALDH1A1 (0.78) | ALDH1A1GLATDP1GAAMAPT | |
| SCHEMBL10605849 | 0.81 | ALDH1A1 (0.50) | ALDH1A1GLATDP1GAAMAPT | |
| SCHEMBL1698264 | 0.81 | ALDH1A1 (0.71) | ALDH1A1GLATDP1MAPTTP53 | |
| SCHEMBL26253967 | 0.81 | ALDH1A1 (0.71) | ALDH1A1GLATDP1MAPTTP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111978898-B | Method for producing pressure-sensitive adhesive reactive adhesive tape | 德莎欧洲股份公司 | 2022-09-09 | — | — | CN | disclosed |
| CN-113930183-A | Storage-stable reactive pressure-sensitive adhesive tape | 德莎欧洲股份公司 | 2022-01-14 | — | — | CN | disclosed |
| EP-3861081-A1 | LATENTLY REACTIVE ADHESIVE FILM | tesa SE (DE) | 2021-08-11 | — | — | EP | disclosed |
| CN-106118566-B | Adhesive tape with adhesive comprising a continuous polymer phase | 德莎欧洲股份公司 | 2021-06-29 | — | — | CN | disclosed |
| CN-107207456-B | Latent acids and their use | 巴斯夫欧洲公司 | 2021-05-04 | — | — | CN | disclosed |
| CN-109994288-B | Forming rigid armored cables with curable jacket | 德莎欧洲股份公司 | 2021-02-26 | — | — | CN | disclosed |
| CN-111978898-A | Method for producing pressure-sensitive adhesive reactive adhesive tape | 德莎欧洲股份公司 | 2020-11-24 | — | — | CN | disclosed |
| CN-108138014-B | Flexible pressure sensitive adhesive tape for structural bonding | 德莎欧洲股份公司 | 2020-11-24 | — | — | CN | disclosed |
| EP-3714001-A1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2020-09-30 | — | — | EP | disclosed |
| WO-2020069884-A1 | LATENTLY REACTIVE ADHESIVE FILM | TESA SE (DE) | 2020-04-09 | — | — | WO | disclosed |
| EP-3350271-A1 | FLEXIBLE ADHESIVE PLANAR FORMATION FOR STRUCTURAL BONDING | tesa SE (DE) | 2018-07-25 | — | — | EP | disclosed |
| EP-3350270-A1 | FLEXIBLE PRESSURE-SENSITIVE ADHESIVE TAPE FOR STRUCTURAL ADHESION | tesa SE (DE) | 2018-07-25 | — | — | EP | disclosed |
| CN-105541659-A | Halogenated oxime derivatives and their use as potential acid | CIBA SPECIALTY CHEMICALS HOLDING INC | 2016-05-04 | — | — | CN | disclosed |
| EP-0838499-A1 | Two-part low density curing epoxy composition and use thereof as void filler | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1998-04-29 | — | — | EP | disclosed |