Ethylenediamine

Ethylenediamine

SCHEMBL8619347

Cl.Cl.NCCN.NCCN

nearest known ligand 0.50

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Known targets — ChEMBL curated mechanism

ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D

The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.50
ALDH1A1 P00352 3/20 0.50
TDP1 Q9NUW8 2/20 0.50
LMNA P02545 2/20 0.50
BLM P54132 2/20 0.50
NFKB1 P19838 1/20 0.44
EHMT2 Q96KQ7 1/20 0.42
TSHR P16473 3/20 0.40
CA12 O43570 2/20 0.40
CA1 P00915 2/20 0.40
CA2 P00918 2/20 0.40
CA3 P07451 2/20 0.40
CA4 P22748 2/20 0.40
CA6 P23280 2/20 0.40
CA5A P35218 2/20 0.40
CA7 P43166 2/20 0.40
CA9 Q16790 2/20 0.40
CA14 Q9ULX7 2/20 0.40
CA5B Q9Y2D0 2/20 0.40
DNM1 Q05193 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylenediamine SCHEMBL11381182 1.00 MAPT (0.50) MAPTALDH1A1TDP1LMNABLM
Ethylenediamine SCHEMBL11229397 1.00 MAPT (0.50) MAPTALDH1A1TDP1LMNABLM
Ethylenediamine SCHEMBL28445890 1.00 MAPT (0.50) MAPTALDH1A1TDP1LMNABLM
Ethylenediamine SCHEMBL1331588 1.00
Ethylenediamine SCHEMBL338154 1.00
Ethylenediamine SCHEMBL16761050 1.00
Ethylenediamine SCHEMBL8414481 1.00
Ethylenediamine SCHEMBL11440118 1.00 MAPT (0.50) MAPTALDH1A1TDP1LMNABLM
Ethylenediamine SCHEMBL371485 1.00
Ethylenediamine SCHEMBL1331073 1.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240295038-A1 METAL-IMPREGNATED CARBON MATERIALS UNITED STATES DEPARTMENT OF ENERGY 2024-09-05 US claimed
JP-10284541-A None JP disclosed
US-20240295038-A1 METAL-IMPREGNATED CARBON MATERIALS UNITED STATES DEPARTMENT OF ENERGY 2024-09-05 US disclosed
CN-115598185-A Composite gas-sensitive material and preparation method and application thereof 南方电网数字电网研究院有限公司(CN) 2023-01-13 CN disclosed
JP-H10284541-A SUPPORTING SUBSTRATE, METHOD FOR PRODUCING SUPPORTING SUBSTRATE, ELECTRONIC COMPONENT DEVICE AND METHOD FOR SURFACE TREATING SUPPORTING SUBSTRATE HITACHI CHEM CO LTD 1998-10-23 JP disclosed