SCHEMBL8638825

SCHEMBL8638825

CCCCOCC(O)C/C=C(\C)C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
USP2 O75604 2/20 0.49
KDM4E B2RXH2 2/20 0.49
ALDH1A1 P00352 2/20 0.49
ALOX15 P16050 1/20 0.49
HTT P42858 1/20 0.42
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2C19 P33261 1/20 0.41
LPAR5 Q9H1C0 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.39
PLA2G2C Q5R387 5/20 0.38
P2RY10 O00398 1/20 0.38
HSD17B10 Q99714 1/20 0.35
CES2 O00748 1/20 0.35
PLA2G4B P0C869 1/20 0.34
SPHK1 Q9NYA1 1/20 0.33
HCAR2 Q8TDS4 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1260034 1.00 USP2 (0.49) USP2KDM4EALDH1A1ALOX15HTT
SCHEMBL14717768 0.94 USP2 (0.53) USP2KDM4EALDH1A1ALOX15HTT
SCHEMBL4291479 0.94 USP2 (0.53) USP2KDM4EALDH1A1ALOX15HTT
SCHEMBL3619334 0.89 ALDH1A1 (0.35) USP2KDM4EALDH1A1ALOX15HTT
SCHEMBL3619332 0.89 ALDH1A1 (0.35) USP2KDM4EALDH1A1ALOX15HTT
SCHEMBL3675949 0.84 USP2 (0.37) USP2KDM4EALDH1A1ALOX15HTT
SCHEMBL6250554 0.83 TSHR (0.36) USP2KDM4EALDH1A1ALOX15
SCHEMBL6250559 0.83 TSHR (0.36) USP2KDM4EALDH1A1ALOX15
SCHEMBL6048114 0.81 TSHR (0.43) USP2KDM4EALDH1A1ALOX15CYP3A4
SCHEMBL2763358 0.80 MAPT (0.33) USP2KDM4EALDH1A1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0588534-B1 Radiation curing ink HAYAKAWA RUBBER (JP) 1998-12-02 EP claimed
EP-0588533-B1 Printed thermoplastic resin products and method for printing such products HAYAKAWA RUBBER (JP) 1998-08-12 EP claimed
US-20250341778-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-11-06 US disclosed
US-12386259-B2 Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-08-12 US disclosed
US-20210294213-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-09-23 US disclosed