SCHEMBL864658

SCHEMBL864658

[Bi+3].[O-2].[O-2].[O-2].[O-2].[O-2].[Sr+2].[Ta+5]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

HRH2

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8584083 0.89
SCHEMBL4649951 0.87
SCHEMBL4649934 0.87
SCHEMBL3911824 0.87
SCHEMBL1897527 0.87
SCHEMBL15129704 0.87
SCHEMBL7109941 0.75
SCHEMBL7875461 0.75
SCHEMBL4928849 0.75
SCHEMBL20512286 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 368 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117672704-A Capacitor capable of releasing active oxygen ions and active nitrogen ions after being electrified 张崇泰 2024-03-08 CN claimed
US-11640995-B2 Ferroelectric field effect transistors (FeFETs) having band-engineered interface layer INTEL CORPORATION (US) 2023-05-02 US claimed
US-20200144293-A1 FERROELECTRIC FIELD EFFECT TRANSISTORS (FEFETS) HAVING AMBIPOLAR CHANNELS INTEL CORP (US) 2020-05-07 US claimed
US-20200105940-A1 FERROELECTRIC FIELD EFFECT TRANSISTORS (FEFETS) HAVING BAND-ENGINEERED INTERFACE LAYER INTEL CORPORATION 2020-04-02 US claimed
WO-2019054993-A1 FERROELECTRIC FIELD EFFECT TRANSISTORS (FEFETS) HAVING AMBIPOLAR CHANNELS INTEL CORPORATION (US) 2019-03-21 WO claimed
US-20190019551-A1 NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING NONVOLATILE MEMORY DEVICE SK Hynix Inc. (KR) 2019-01-17 US claimed
US-9831085-B2 Method of fabricating hafnium oxide layer and semiconductor device having the same SK Hynix Inc. (KR) 2017-11-28 US claimed
US-20170004967-A1 METHOD OF FABRICATING HAFNIUM OXIDE LAYER AND SEMICONDUCTOR DEVICE HAVING THE SAME SK Hynix Inc. (KR) 2017-01-05 US claimed
EP-2695018-B1 NANOPARTICLE COMPLEX, LIGHT CONVERSION MEMBER AND DISPLAY DEVICE HAVING THE SAME, AND METHOD FOR FABRICATING THE SAME LG INNOTEK CO LTD (KR) 2016-12-28 EP claimed
US-8944619-B2 Nanoparticle complex, light conversion member and display device having the same, and method for fabricating the same LG INNOTEK CO., LTD. (KR) 2015-02-03 US claimed
US-20100123176-A1 SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2010-05-20 US claimed
US-20100067643-A1 High dielectric insulated coax cable for sensitive impedance monitoring GENERAL ELECTRIC COMPANY (US) 2010-03-18 US claimed
US-20070020164-A1 Process for producing fine metal oxide particles SHOWA DENKO K.K. (JP) 2007-01-25 US claimed
EP-1670716-A1 PROCESS FOR PRODUCING FINE METAL OXIDE PARTICLES Showa Denko K.K. (JP) 2006-06-21 EP claimed
US-6882516-B2 Thin film capacitor and method of manufacturing the same FUJITSU LIMITED (JP) 2005-04-19 US claimed
WO-2005021425-A1 PROCESS FOR PRODUCING FINE METAL OXIDE PARTICLES SHOWA DENKO K.K. (JP) 2005-03-10 WO claimed
US-20030184952-A1 Thin film capacitor and method of manufacturing the same FUJITSU LIMITED (JP) 2003-10-02 US claimed
US-5935549-A Method of producing bismuth layered compound SONY CORPORATION (JP) 1999-08-10 US claimed
US-5792324-A Method and apparatus of forming a thin film LG SEMICON CO., LTD. (KR) 1998-08-11 US claimed
US-5716875-A Method for making a ferroelectric device MOTOROLA, INC. (US) 1998-02-10 US claimed