SCHEMBL866535

SCHEMBL866535

C=C(O)CCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1908236 0.90
SCHEMBL805230 0.88 GPR84 (0.55)
SCHEMBL4558847 0.88 GPR84 (0.55)
SCHEMBL1905995 0.88 GPR84 (0.55)
SCHEMBL49642 0.88
SCHEMBL2745492 0.88 GPR84 (0.55)
SCHEMBL18823640 0.88 GPR84 (0.55)
SCHEMBL19382202 0.88 GPR84 (0.55)
SCHEMBL18619738 0.88 GPR84 (0.55)
SCHEMBL2514471 0.88 GPR84 (0.55)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 435 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4359604-B1 SHEET-LIKE PRODUCT AND METHOD FOR ITS MANUFACTURE MM KOTKAMILLS OY (FI) 2025-12-17 EP claimed
EP-4196636-B1 MULTI-LAYER METALLIZED PAPER-BASED PACKAGING MATERIAL NESTLE SA (CH) 2025-11-05 EP claimed
US-20240328092-A1 SHEET-LIKE PRODUCT AND METHOD FOR ITS MANUFACTURE MM KOTKAMILLS OY (FI) 2024-10-03 US claimed
EP-4359604-A1 SHEET-LIKE PRODUCT AND METHOD FOR ITS MANUFACTURE MM Kotkamillis OY (FI) 2024-05-01 EP claimed
US-20230272584-A1 MULTI-LAYER METALLIZED PAPER-BASED PACKAGING MATERIAL SOCIETE DES PRODUITS NESTLE S.A. (CH) 2023-08-31 US claimed
EP-4196636-A1 MULTI-LAYER METALLIZED PAPER-BASED PACKAGING MATERIAL Société des Produits Nestlé S.A. (CH) 2023-06-21 EP claimed
CN-116133856-A Multilayer metallized paper-based packaging material 雀巢产品有限公司 2023-05-16 CN claimed
WO-2022269141-A1 SHEET-LIKE PRODUCT AND METHOD FOR ITS MANUFACTURE MM KOTKAMILLS OY (FI) 2022-12-29 WO claimed
WO-2022023077-A1 MULTI-LAYER METALLIZED PAPER-BASED PACKAGING MATERIAL Société des Produits Nestlé S.A. (CH) 2022-02-03 WO claimed
CN-109312009-A Latex for improved water resistance without high performance surfactants 罗地亚经营管理公司 2019-02-05 CN claimed
CN-102245652-A Copolymers comprising acid building blocks and polyether building blocks of various types CONSTR RES & TECH GMBH 2011-11-16 CN claimed
CN-1743408-A Sigma-pi conjugated organic polymer material, and its preparing method and use UNIV FUDAN (CN) 2006-03-08 CN claimed
US-20050255339-A1 Metal air cell system EVIONYX 2005-11-17 US claimed
EP-1476911-A2 METAL AIR CELL SYSTEM Evionyx, Inc. (US) 2004-11-17 EP claimed
WO-2003071620-A2 METAL AIR CELL SYSTEM EVIONYX, INC. (US) 2003-08-28 WO claimed
US-20020142203-A1 Anode inserted into cathode structure EVIONYX, INC. 2002-10-03 US claimed
WO-2002073732-A2 REFUELABLE METAL AIR ELECTROCHEMICAL CELL WITH REPLACABLE ANODE STRUCTURE EVIONYX, INC. (US) 2002-09-19 WO claimed
EP-0685880-B1 Method for interconnecting an electronic device using a removable solder carrying medium AT & T CORP (US) 2000-07-26 EP claimed
US-5509815-A Solder medium for circuit interconnection AT&T CORP. (US) 1996-04-23 US claimed
EP-0687137-A2 Solder medium for circuit interconnection AT&T Corp. (US) 1995-12-13 EP claimed