O-Xylene

O-Xylene

SCHEMBL8668583

Cc1ccccc1C.[AlH3]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
O-Xylene SCHEMBL11033471 0.95 TSHR (1.00) —
O-Xylene SCHEMBL29385454 0.95 — —
O-Xylene SCHEMBL11034038 0.95 TSHR (1.00) —
O-Xylene SCHEMBL2854068 0.95 — —
O-Xylene SCHEMBL11035539 0.95 TSHR (1.00) —
O-Xylene SCHEMBL772 0.95 — —
O-Xylene SCHEMBL170581 0.95 TSHR (1.00) —
O-Xylene SCHEMBL10522915 0.95 TSHR (1.00) —
O-Xylene SCHEMBL8216257 0.95 TSHR (1.00) —
O-Xylene SCHEMBL6898695 0.95 TSHR (1.00) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110218456-A Cyclohexyl LED encapsulation material and preparation method thereof 广东信翼科技有限公司 2019-09-10 — — CN disclosed
CN-108431004-A Heterocyclic compounds 武田药品工业株式会社 2018-08-21 — — CN disclosed
CN-105017966-B OVPOSS is crosslinked fluorine silicon block copolymer ultraviolet curable coating and preparation and application 天津大学 2017-06-16 — — CN disclosed
CN-106316994-A Method for preparing and separating 2,5-diformylfuran (DFF) and 2,5-dihydroxymethylfuran (DHMF) simultaneously 复旦大学 2017-01-11 — — CN disclosed
CN-100354283-C Covalently fixed non-metallocenes, method for the production thereof and their use for polymerizing olefins CELANESE VENTURES GMBH (DE) 2007-12-12 — — CN disclosed
CN-1642962-A Covalently bound non-metallocenes, method for the production thereof and use thereof in the polymerization of olefins CELANESE VENTURES GMBH (DE) 2005-07-20 — — CN disclosed
US-5723071-A Bake-hardenable solution for forming a conductive coating THOMSON CONSUMER ELECTRONICS, INC. (US) 1998-03-03 — — US disclosed
Send feedback