SCHEMBL868277

SCHEMBL868277

CCCCCCCC(CO)(CO)CO

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.48
TSHR P16473 2/20 0.48
ALDH1A1 P00352 1/20 0.48
HSD17B10 Q99714 1/20 0.48
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
GGPS1 O95749 6/20 0.44
THRB P10828 1/20 0.44
FDPS P14324 9/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
CES2 O00748 1/20 0.41
LPAR1 Q92633 1/20 0.41
LPAR3 Q9UBY5 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19858915 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL1841682 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL7796683 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL7796853 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL7796670 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL1842994 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL9098253 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL2109769 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL2112471 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1
SCHEMBL7611698 1.00 LMNA (0.48) LMNATSHRALDH1A1HSD17B10MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 569 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4423165-B1 A POLYMER BEING SUITABLE AS INERT COMPONENT OF A RADIATION CURING COATING AND IN PARTICULAR OF A RADIATION CURING INK HUBERGROUP DEUTSCHLAND GMBH (DE) 2025-09-24 EP claimed
EP-4596564-A1 METHOD FOR PREPARING A HOMOGENEOUS SOLUTION OF A METAL BISPIDONE CHELATE COMPLEX FOR OXIDATIVELY DRYING SYSTEMS hubergroup Deutschland GmbH (DE) 2025-08-06 EP claimed
US-20250066616-A1 A rosin polymer to be used as inert component in a coating, in particular a radiation curing coating such as a radiation curing printing ink HUBERGROUP DEUTSCHLAND GMBH (DE) 2025-02-27 US claimed
US-20250034320-A1 A polymer being suitable as inert component of a radiation curing coating and in particular of a radiation curing ink HUBERGROUP DEUTSCHLAND GMBH (DE) 2025-01-30 US claimed
CN-112599508-B Conductive composition and method for manufacturing micro light emitting diode display device 财团法人工业技术研究院 2025-01-10 CN claimed
CN-118667600-A Diesel engine oil and preparation method thereof 一汽解放汽车有限公司 2024-09-20 CN claimed
EP-4423165-A1 A POLYMER BEING SUITABLE AS INERT COMPONENT OF A RADIATION CURING COATING AND IN PARTICULAR OF A RADIATION CURING INK hubergroup Deutschland GmbH (DE) 2024-09-04 EP claimed
US-20240166928-A1 LAMINATING ADHESIVE BOSTIK SA (FR) 2024-05-23 US claimed
CN-117447703-A Multifunctional group modified silane compound and preparation method thereof, hardening coating and preparation method thereof 深圳市华星光电半导体显示技术有限公司 2024-01-26 CN claimed
EP-4308622-A1 LAMINATING ADHESIVE Bostik SA (FR) 2024-01-24 EP claimed
CN-112940280-B Amphiphilic hyperbranched star-shaped copolymer and preparation method thereof 烟台大学 2022-11-01 CN claimed
WO-2022195235-A1 LAMINATING ADHESIVE BOSTIK SA (FR) 2022-09-22 WO claimed
US-20220064456-A1 PHOTOCURABLE RESIN COMPOSITION, INK AND COATING MATERIAL OSAKA SODA CO., LTD. (JP) 2022-03-03 US claimed
CN-113321785-A Shape memory material and preparation method and application thereof 五邑大学 2021-08-31 CN claimed
CN-112940280-A Amphiphilic hyperbranched star-shaped copolymer and preparation method thereof 烟台大学 2021-06-11 CN claimed
CN-111662486-A Method for improving tensile strength of bio-based degradable material 上海叶心材料科技有限公司 2020-09-15 CN claimed
CN-110972480-A Styrene-acrylate copolymer 株式会社大阪曹达 2020-04-07 CN claimed
EP-2147942-B1 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION, CURED BODY THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING THE EPOXY RESIN COMPOSITION NITTO DENKO CORP (JP) 2016-07-06 EP claimed
US-20100164127-A1 EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME NITTO DENKO CORPORATION (JP) 2010-07-01 US claimed
EP-2147942-A1 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION, CURED BODY THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING THE EPOXY RESIN COMPOSITION Nitto Denko Corporation (JP) 2010-01-27 EP claimed