SCHEMBL869199

SCHEMBL869199

CC(S)CC(=O)OCC(O)COc1ccc(C(C)(C)c2ccc(OCC(O)COC(=O)CC(C)S)cc2)cc1

nearest known ligand 0.62

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.51
HIF1A Q16665 1/20 0.51
AR P10275 2/20 0.50
KDM4E B2RXH2 3/20 0.46
ALDH1A1 P00352 3/20 0.46
MAPT P10636 3/20 0.44
POLB P06746 2/20 0.44
LMNA P02545 2/20 0.44
NPSR1 Q6W5P4 2/20 0.44
KMT2A Q03164 3/20 0.44
MEN1 O00255 2/20 0.43
CYP1A2 P05177 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.41
TDP1 Q9NUW8 1/20 0.39
HSD17B10 Q99714 1/20 0.39
MITF O75030 1/20 0.39
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14130193 0.84 HTT (0.56) HTTHIF1AARKDM4EALDH1A1
SCHEMBL5799408 0.84 KDM4E (0.48) HTTHIF1AARKDM4EALDH1A1
SCHEMBL20968083 0.82 HTT (0.54) HTTHIF1AARKDM4EALDH1A1
SCHEMBL25888687 0.82 HTT (0.57) HTTHIF1AARKDM4EALDH1A1
SCHEMBL5799419 0.82 AR (0.38) HTTHIF1AARKDM4EALDH1A1
SCHEMBL20734763 0.82 AR (0.45) HTTHIF1AARKDM4EALDH1A1
SCHEMBL6131228 0.81 AR (0.62) HTTHIF1AARKDM4EALDH1A1
SCHEMBL12138200 0.80 HTT (0.57) HTTHIF1AARKDM4EALDH1A1
SCHEMBL21168748 0.79 KDM4E (0.46) HTTARKDM4EALDH1A1MAPT
SCHEMBL20968045 0.78 HTT (0.53) HTTHIF1AARKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-10675842-B2 Transparent electrode and organic electronic device including the same Konica Minolta, Inc. (JP) 2020-06-09 US disclosed
US-20190047258-A1 TRANSPARENT ELECTRODE AND ORGANIC ELECTRONIC DEVICE INCLUDING THE SAME MERCK PATENT GMBH (DE) 2019-02-14 US disclosed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP disclosed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed