Nitric Acid

Nitric Acid

SCHEMBL8715284

F.N.N.O=[N+]([O-])O

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ERG11

The experimentally established mechanism targets of Nitric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Nitric Acid SCHEMBL4239638 1.00
Nitric Acid SCHEMBL28965888 0.95 CA5A (0.73)
Nitric Acid SCHEMBL27386902 0.95
Nitric Acid SCHEMBL11505123 0.95
Nitric Acid SCHEMBL11505124 0.95
Nitric Acid SCHEMBL1416 0.95
Nitric Acid SCHEMBL310885 0.95
Nitric Acid SCHEMBL6034837 0.95 CA5A (0.89)
Nitric Acid SCHEMBL11229873 0.95 CA5A (0.89)
Nitric Acid SCHEMBL11758696 0.95 CA5A (0.89)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0406859-B1 Process for producing a resin molded article having a metal plated layer thereon MITSUI PETROCHEMICAL IND (JP) 1996-01-10 EP claimed
EP-0323685-B1 PROCESS FOR THE PRODUCTION OF MOLDED ARTICLES HAVING PARTIAL METAL PLATING SANKYO KASEI KABUSHIKI KAISHA (JP) 1992-07-01 EP claimed
US-5015519-A Molded article with partial metal plating and a process for producing such article SANKYO KASEI KABUSHIKI KAISHA (JP) 1991-05-14 US claimed
US-4812275-A Process for the production of molded articles having partial metal plating SANKYO KASEI KABUSHIKI KAISHA (JP) 1989-03-14 US claimed
US-4812353-A Process for the production of circuit board and the like SANKYO KASEI KABUSHIKI KAISHA (JP) 1989-03-14 US claimed
US-3936331-A Process for forming sloped topography contact areas between polycrystalline silicon and single-crystal silicon FAIRCHILD CAMERA AND INSTRUMENT CORPORATION (US) 1976-02-03 US claimed
WO-2024089850-A1 POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD 株式会社レゾナック 2024-05-02 WO disclosed
WO-2023174450-A2 SILICONE MATERIAL, SILICONE TUBE, IMPLANT, PHARMACEUTICAL COMPOSITION, AND TEST METHOD FOR AMOUNT OF DRUG RELEASED 沈阳星华医药科技有限公司 2023-09-21 WO disclosed
US-9645262-B2 Capacitance reduction for pillar structured devices LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (US) 2017-05-09 US disclosed
US-20160356901-A1 CAPACITANCE REDUCTION FOR PILLAR STRUCTURED DEVICES LAWRENCE LIVERMORE NATIONAL SECURITY, LLC 2016-12-08 US disclosed
CN-101803025-B semiconductor device, process for producing semiconductor device, semiconductor equipment and calculating system of semiconductor equipment MICRON TECHNOLOGY INC 2014-07-02 CN disclosed
CN-101803025-A Buried low-resistance metal word lines for cross-point variable-resistance material memories MICRON TECHNOLOGY INC 2010-08-11 CN disclosed
EP-0374256-B1 OPTICAL RECORDING MEDIUM AND METHOD OF MANUFACTURING SAME DAINIPPON PRINTING CO LTD (JP) 1998-02-25 EP disclosed
EP-0374256-A1 OPTICAL RECORDING MEDIUM AND METHOD OF MANUFACTURING SAME DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) 1990-06-27 EP disclosed
US-4908259-A Molded article with partial metal plating and a process for producing such article SANKYO KASEI KABUSHIKI KAISHA (JP) 1990-03-13 US disclosed
EP-0323685-A1 Process for the production of molded articles having partial metal plating SANKYO KASEI KABUSHIKI KAISHA (JP) 1989-07-12 EP disclosed
US-4812275-A Process for the production of molded articles having partial metal plating SANKYO KASEI KABUSHIKI KAISHA (JP) 1989-03-14 US disclosed
US-4812353-A Process for the production of circuit board and the like SANKYO KASEI KABUSHIKI KAISHA (JP) 1989-03-14 US disclosed
EP-0299073-A1 OPTICAL RECORDING MEDIUM AND PRODUCTION THEREOF DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) 1989-01-18 EP disclosed
US-3936331-A Process for forming sloped topography contact areas between polycrystalline silicon and single-crystal silicon FAIRCHILD CAMERA AND INSTRUMENT CORPORATION (US) 1976-02-03 US disclosed