SCHEMBL871610

SCHEMBL871610

COP(=O)(O)C(CC(=O)O)C(=O)O

nearest known ligand 0.45

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 6/20 0.45
LAP3 P28838 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
CA2 P00918 1/20 0.35
CA4 P22748 1/20 0.35
GGH Q92820 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
GRM3 Q14832 2/20 0.34
NAALAD2 Q9Y3Q0 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11689525 0.84 FOLH1 (0.34) FOLH1LAP3TDP1CA2CA4
SCHEMBL10875658 0.81 FOLH1 (0.38) FOLH1TDP1CA2CA4SMN1; SMN2
SCHEMBL3900935 0.81 FOLH1 (0.42) FOLH1LAP3CA2GGHGRM3
SCHEMBL9184937 0.80 FOLH1 (0.38) FOLH1LAP3TDP1CA2CA4
SCHEMBL28423960 0.79 FOLH1 (0.41) FOLH1TDP1CA2CA4SMN1; SMN2
SCHEMBL4007537 0.78 FOLH1 (0.46) FOLH1TDP1CA2CA4GGH
SCHEMBL2327068 0.75 FOLH1 (0.48) FOLH1TDP1CA2CA4SMN1; SMN2
SCHEMBL1561758 0.75 FOLH1 (0.60) FOLH1TDP1CA2CA4SMN1; SMN2
SCHEMBL11688744 0.74 CYP3A4 (0.42)
SCHEMBL18042480 0.73 FOLH1 (0.58) FOLH1TDP1CA2CA4SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 338 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113710761-B Surface coated abrasive particles for tungsten polishing applications CMC材料有限责任公司 2024-04-09 CN claimed
CN-111183195-B Surface treated abrasive particles for tungsten buffing applications CMC材料股份有限公司 2022-05-10 CN claimed
CN-113710761-A Surface-coated abrasive particles for tungsten buffing applications CMC材料股份有限公司 2021-11-26 CN claimed
US-20210198524-A1 POLISHING COMPOSITION FOR MAGNETIC DISK SUBSTRATE YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2021-07-01 US claimed
CN-111183195-A Surface treated abrasive particles for tungsten buffing applications 嘉柏微电子材料股份公司 2020-05-19 CN claimed
US-20180371293-A1 POLISHING COMPOSITION FOR MAGNETIC DISK SUBSTRATE YAMAGUCHI SEIKEN KOGYO CO., LTD. (JP) 2018-12-27 US claimed
EP-3263687-A1 ANTIMICROBIAL HARD SURFACE CLEANING COMPOSITION The Procter & Gamble Company (US) 2018-01-03 EP claimed
EP-3263688-A1 IMPROVED SHINE IN SOFT WATER The Procter & Gamble Company (US) 2018-01-03 EP claimed
US-9340707-B2 Polishing composition to be used to polish semiconductor substrate having silicon through electrode structure, and polishing method using polishing composition FUJIMI INCORPORATED (JP) 2016-05-17 US claimed
US-6503420-B1 Such as lithium chloride and 2-phosphono-1,2,4-butanetri-carboxylic acid; environmentally friendly; efficient; durability FMC CORPORATION 2003-01-07 US claimed
WO-1999002767-A1 A METHOD FOR PRE-FIBRILLATION OF LYOCELL NOVO NORDISK A/S (DK) 1999-01-21 WO claimed
EP-0728180-B1 ADDITIVE FOR USE IN GLASS-BOTTLE WASHING AND ITS USE IN DECREASING GLASS CORROSION HENKEL ECOLAB GMBH & CO OHG (DE) 1998-08-26 EP claimed
US-5562830-A IN MIXTURE WITH POLYEPOXYSUCCINIC ACID AND A PHOSPHONOCARBOXYLIC ACID BETZ LABORATORIES, INC. (US) 1996-10-08 US claimed
US-12516276-B2 Surface treatment composition FUJIMI INCORPORATED (JP) 2026-01-06 US disclosed
CN-116323842-B Abrasive composition and polishing method using the same 山口精研工业株式会社 2025-05-30 CN disclosed
US-12305081-B2 Polishing composition JAPAN VAM & POVAL CO., LTD. (JP) 2025-05-20 US disclosed
US-4020101-A CLEANSING COMPOUNDS BAYER AKTIENGESELLSCHAFT (DT) 1977-04-26 US disclosed
US-3959168-A Synergistic sequestering agent compositions HENKEL & CIE G.M.B.H. (DT) 1976-05-25 US disclosed
US-3959168-A Synergistic sequestering agent compositions HENKEL & CIE G.M.B.H. (DT) 1976-05-25 US disclosed
US-3933427-A Process for preventing corrosion and the formation of scale in water circulating system BAYER AKTIENGESELLSCHAFT (DT) 1976-01-20 US disclosed