SCHEMBL8745386

SCHEMBL8745386

CCCCCCCCCCCCCCCCCCc1cc(-c2ccccc2)c(O)c(-c2ccccc2)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS2 P35354 4/20 0.53
CYP3A4 P08684 2/20 0.50
TRPV1 Q8NER1 1/20 0.49
ESR1 P03372 2/20 0.49
ADRA2A P08913 2/20 0.49
ADORA3 P0DMS8 2/20 0.49
TACR2 P21452 2/20 0.49
SLC6A2 P23975 2/20 0.49
SLC6A4 P31645 2/20 0.49
SLC6A3 Q01959 2/20 0.49
KDM4E B2RXH2 1/20 0.49
ALDH1A1 P00352 1/20 0.49
LMNA P02545 1/20 0.49
SHBG P04278 1/20 0.49
TP53 P04637 1/20 0.49
HSPD1 P10809 1/20 0.49
ADRB3 P13945 1/20 0.49
HTR2C P28335 1/20 0.49
HSPE1 P61604 1/20 0.49
HIF1A Q16665 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL202228 1.00 PTGS2 (0.53) PTGS2CYP3A4TRPV1ESR1ADRA2A
SCHEMBL200837 0.93 PSMB5 (0.52) PTGS2CYP3A4TRPV1PSMB5RARB
SCHEMBL9180655 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9182437 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9181706 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9183984 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9180703 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9178175 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9185387 0.91 PTPN1 (0.50) ALDH1A1HSD17B10
SCHEMBL9181976 0.91 PTPN1 (0.50) ALDH1A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116848467-A Photosensitive resin composition, cured film, and semiconductor device 住友电木株式会社 2023-10-03 CN disclosed
CN-108137875-B Polymer compositions and composites thereof for forming melt-extruded films 塞拉尼斯伊娃高性能聚合物公司 2021-04-27 CN disclosed
EP-0524640-B1 Diarylphosphinous acid arylesters, process for their preparation and their use to stabilize polymers, in particular polyolefin moulding compositions HOECHST AG (DE) 1997-01-29 EP disclosed
US-5281640-A For thermoplastic or thermosetting plastics, polymer-containing polymerized mono- or diolefin molding materials HOECHST AKTIENGESELLSCHAFT (DE) 1994-01-25 US disclosed
EP-0524640-A1 Diarylphosphinous acid arylesters, process for their preparation and their use to stabilize polymers, in particular polyolefin moulding compositions HOECHST AKTIENGESELLSCHAFT (DE) 1993-01-27 EP disclosed