⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL876403 | 1.00 | — | — | |
| SCHEMBL4973846 | 0.84 | — | — | |
| SCHEMBL4973837 | 0.84 | — | — | |
| SCHEMBL13344723 | 0.83 | ALDH1A1 (0.38) | — | |
| SCHEMBL134222 | 0.81 | — | — | |
| SCHEMBL11739166 | 0.81 | — | — | |
| SCHEMBL4198587 | 0.81 | — | — | |
| SCHEMBL3626172 | 0.78 | ALDH1A1 (0.43) | — | |
| SCHEMBL3626176 | 0.78 | ALDH1A1 (0.43) | — | |
| SCHEMBL6708516 | 0.78 | ALDH1A1 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130119322-A1 | CONDUCTIVE SINTERED LAYER FORMING COMPOSITION | HITACHI LTD. (JP) | 2013-05-16 | — | — | US | disclosed |
| US-8400777-B2 | Electronic member, electronic part and manufacturing method therefor | HITACHI, LTD. (JP) | 2013-03-19 | — | — | US | disclosed |
| WO-2012038197-A1 | COATING AGENT HAVING (METH)ACRYLIC POLYMERS AND COALESCENCE ADDITIVES | EVONIK RÖHM GMBH (DE) | 2012-03-29 | — | — | WO | disclosed |
| WO-2010112288-A1 | COATING AGENT, METHOD FOR PRODUCING A COATING AND COATED OBJECT | EVONIK RÖHM GMBH (DE) | 2010-10-07 | — | — | WO | disclosed |
| US-20100195292-A1 | ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR | HITACHI, LTD. | 2010-08-05 | — | — | US | disclosed |
| US-20080160183-A1 | Organic coated metal particles promoted with silver oxide particles; low temperature and pressure; preventing damage of electronic parts and semiconductors | HITACHI, LTD. (JP) | 2008-07-03 | — | — | US | disclosed |