SCHEMBL8768772

SCHEMBL8768772

CCCC(C)OO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9340168 0.83 MAPK1 (0.30)
SCHEMBL13407751 0.82
SCHEMBL3237628 0.82 TDP1 (0.38)
SCHEMBL28549144 0.80
SCHEMBL11798879 0.78 FAAH (0.47)
SCHEMBL13705059 0.78 TSHR (0.35)
SCHEMBL17240353 0.78 FAAH (0.47)
SCHEMBL13713631 0.78 FAAH (0.47)
SCHEMBL25780061 0.76 TSHR (0.33)
SCHEMBL3871035 0.75 CA1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4502064-A1 CURABLE COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2025-02-05 EP claimed
US-20250034429-A1 CURABLE COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2025-01-30 US claimed
WO-2024225464-A1 CURABLE COMPOSITION ダイキン工業株式会社 2024-10-31 WO claimed
WO-2024225461-A1 CURABLE COMPOSITION ダイキン工業株式会社 2024-10-31 WO claimed
WO-2023190723-A1 CURABLE COMPOSITION ダイキン工業株式会社 2023-10-05 WO claimed
WO-2023190725-A1 CURABLE COMPOSITION ダイキン工業株式会社 2023-10-05 WO claimed
WO-2023190766-A1 CURABLE COMPOSITION ダイキン工業株式会社 2023-10-05 WO claimed
WO-2023190742-A1 CURABLE COMPOSITION ダイキン工業株式会社 2023-10-05 WO claimed
WO-2025027951-A1 PREPREG AND FIBER-REINFORCED PLASTIC 三菱ケミカル株式会社 2025-02-06 WO disclosed
EP-4502064-A1 CURABLE COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2025-02-05 EP disclosed
US-20250034429-A1 CURABLE COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2025-01-30 US disclosed
WO-2024225464-A1 CURABLE COMPOSITION ダイキン工業株式会社 2024-10-31 WO disclosed
WO-2024225461-A1 CURABLE COMPOSITION ダイキン工業株式会社 2024-10-31 WO disclosed
WO-2023190723-A1 CURABLE COMPOSITION ダイキン工業株式会社 2023-10-05 WO disclosed
CN-101323557-A Low temperature thermal conductive inks AIR PROD & CHEM (US) 2008-12-17 CN disclosed
US-20080049319-A1 POLYMERIZABLE MONOMER, AN OPTICAL COMPENSATION FILM AND A METHOD FOR PRODUCING THE OPTICAL COMPENSATION FILM FUJIFILM CORPORATION (JP) 2008-02-28 US disclosed
CN-1813004-A Polymerization process for preparing (co)polymers AKZO NOBEL NV (NL) 2006-08-02 CN disclosed
EP-0794181-A1 Asymmetric epoxidation using a titanium-containing zeolite and a chiral hydroperoxide ARCO Chemical Technology, L.P. (US) 1997-09-10 EP disclosed
US-5663384-A Asymetric epoxidation using a titanium-containing zeolite and a chiral hydroperoxide ARCO CHEMICAL TECHNOLOGY, L.P. (US) 1997-09-02 US disclosed
US-5166371-A Catalytic epoxidation of allyl alcohol using a hydroperoxide ARCO CHEMICAL TECHNOLOGY, L.P. (US) 1992-11-24 US disclosed