SCHEMBL8820052

SCHEMBL8820052

CCCCC(C)CC.[Pb]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hexadecane SCHEMBL28925203 0.97 DNM1 (0.52)
Tetradecane SCHEMBL7453802 0.97 DNM1 (0.52)
SCHEMBL55575 0.97
SCHEMBL15141786 0.97
SCHEMBL6162852 0.97
SCHEMBL31181925 0.94 ACE2 (0.50)
SCHEMBL31509467 0.94 ACE2 (0.50)
SCHEMBL6526315 0.94 ACE2 (0.50)
SCHEMBL6064437 0.94 ACE2 (0.50)
SCHEMBL6526318 0.94 ACE2 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9171715-A None JP disclosed
CN-112601794-B Adhesive tape 三菱化学株式会社 2023-07-11 CN disclosed
CN-109148789-A Diaphragm, preparation method thereof and lithium ion battery using diaphragm 宁德时代新能源科技股份有限公司 2019-01-04 CN disclosed
CN-102911572-B Coating composition and coating film-forming methods KANSAI COATING CO., LTD. (JP) 2015-08-19 CN disclosed
CN-103965731-A Paint composition and method for forming multi-layer coating KANSAI PAINT CO LTD 2014-08-06 CN disclosed
CN-102911572-A coating composition and coating film formation method KANSAI PAINT CO LTD 2013-02-06 CN disclosed
CN-1237205-C Solution for forming strong dielectric film and process for forming strong dielectric film NEC CORP (JP) 2006-01-18 CN disclosed
CN-1303954-A Solution for forming strong dielectric film and process for forming strong dielectric film NEC CORP (JP) 2001-07-18 CN disclosed
JP-H09171715-A FERROELECTRIC FILM, APPLICATION LIQUID FOR FORMATION OF FILM, MANUFACTURE OF APPLICATION LIQUID, USAGE OF APPLICATION LIQUID OKI ELECTRIC IND CO LTD 1997-06-30 JP disclosed