SCHEMBL8847293

SCHEMBL8847293

Nc1ccc(CC2CO2)c(Cc2c(CC3CO3)ccc(N)c2CC2CO2)c1CC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL186320 0.93
SCHEMBL8847328 0.90
SCHEMBL93720 0.87
SCHEMBL17968405 0.86
SCHEMBL93641 0.82 ALDH1A1 (0.32)
SCHEMBL23094086 0.81 ALDH1A1 (0.31)
SCHEMBL6660500 0.80 TDP1 (0.34)
SCHEMBL93461 0.80 ALDH1A1 (0.34)
SCHEMBL16760960 0.79
Methane SCHEMBL2463087 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0812340-A1 EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER Hexcel Corporation (US) 1997-12-17 EP claimed
WO-1997024398-A1 EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER HEXCEL CORPORATION (US) 1997-07-10 WO claimed
EP-0812340-A1 EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER Hexcel Corporation (US) 1997-12-17 EP disclosed
WO-1997024398-A1 EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER HEXCEL CORPORATION (US) 1997-07-10 WO disclosed