SCHEMBL8853191

SCHEMBL8853191

CC(=CC(C=C(C)C(=O)O)C(C)(CO)CO)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9160145 0.81
SCHEMBL2032664 0.75
SCHEMBL9227511 0.73 PTGS1 (0.32)
SCHEMBL6673233 0.71
SCHEMBL6673228 0.71
SCHEMBL5268893 0.69
SCHEMBL3178769 0.69 PTGS1 (0.32)
SCHEMBL21517654 0.69 PTGS1 (0.32)
SCHEMBL769310 0.68
SCHEMBL10434577 0.67 ALDH1A1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2890734-B1 POLYMER BEADS INCORPORATING SOLID PARTICULATE MATERIAL IXOM OPERATIONS PTY LTD (AU) 2018-02-28 EP claimed
EP-0397091-B1 Methacrylic resin compositions with improved tacky adhesion and method for preparation thereof KURARAY CO (JP) 1997-02-26 EP claimed
EP-0402466-B1 PROCESS FOR PRODUCING METHACRYLIC RESIN MOLDING KURARAY CO (JP) 1995-05-03 EP claimed
EP-0158478-B1 METHACRYLIC RESIN MOLDING MATERIAL AND METHOD FOR PRODUCTION THEREOF Kuraray Co., Ltd. (JP) 1992-07-22 EP claimed
EP-0274808-B1 MOLDED ARTICLE OF METHACRYLIC RESIN AND METHOD FOR PRODUCTION THEREOF Kuraray Co., Ltd. (JP) 1992-05-13 EP claimed