SCHEMBL8853377

SCHEMBL8853377

CCCc1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(CC)c1

nearest known ligand 0.60

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 9/20 0.60
FAAH O00519 3/20 0.48
HSP90AA1 P07900 3/20 0.38
ALDH1A1 P00352 2/20 0.38
HPGD P15428 2/20 0.38
HTT P42858 2/20 0.38
MEN1 O00255 1/20 0.38
LMNA P02545 1/20 0.38
PKM P14618 1/20 0.38
CCR6 P51684 1/20 0.38
KMT2A Q03164 1/20 0.38
ATM Q13315 1/20 0.38
ACACB O00763 3/20 0.38
CACNA1B Q00975 1/20 0.38
APBA1 Q02410 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
G6PD P11413 1/20 0.37
TLR9 Q9NR96 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853344 0.95 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8852702 0.91 MGLL (0.56) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL15442737 0.90 MGLL (0.54) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8852789 0.87 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8852967 0.86 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1LMNA
SCHEMBL8853088 0.86 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8852819 0.86 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8853362 0.86 MGLL (0.58) MGLLFAAHACACB
SCHEMBL8853206 0.84 MGLL (0.56) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8406808 0.84 MGLL (0.56) MGLLFAAHHSP90AA1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117539127-A Composition for forming resist underlayer film containing amide solvent 日产化学株式会社 2024-02-09 CN disclosed
CN-110192152-B Composition for forming resist underlayer film containing amide solvent 日产化学株式会社 2023-11-03 CN disclosed
CN-115975155-A Composition for forming cured film for alignment material, and retardation material 日产化学株式会社 2023-04-18 CN disclosed
CN-111683986-A Composition for forming cured film, alignment material, and phase difference material 日产化学株式会社 2020-09-18 CN disclosed
CN-103493341-B Rotary machine coil and method for manufacturing same 三菱电机株式会社 2016-11-23 CN disclosed
CN-105462598-A Liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal display element CHI MEI CORP 2016-04-06 CN disclosed
CN-104380197-A Alkaline-developable thermosetting resin composition and printed circuit board TAIYO INK MFG CO LTD 2015-02-25 CN disclosed
CN-104334604-A Alkali-developable thermosetting resin composition, and printed wiring board TAIYO INK MFG CO LTD 2015-02-04 CN disclosed
CN-102344816-B Liquid crystal alignment agent, liquid crystal alignment film prepared from same and liquid crystal display element CHI MEI CORP 2014-02-19 CN disclosed
CN-102369231-B Polyester composite for forming thermoset films NISSAN CHEMICAL IND LTD 2013-12-11 CN disclosed
CN-102395614-B Photosensitive polyester composition for use in forming thermally cured film NISSAN CHEMICAL IND LTD 2013-10-30 CN disclosed
CN-102361932-B Polyester composition for forming thermosetting film NISSAN CHEMICAL IND LTD 2013-07-17 CN disclosed
CN-102369230-B Polyester composition for forming thermoset films NISSAN CHEMICAL IND LTD 2013-07-10 CN disclosed
CN-101679633-B Resin composition for forming heat-cured film NISSAN CHEMICAL IND LTD 2012-09-19 CN disclosed
CN-102395614-A Photosensitive polyester composition for use in forming thermally cured film NISSAN CHEMICAL IND LTD 2012-03-28 CN disclosed
CN-102369231-A Polyester composite for forming thermoset films NISSAN CHEMICAL IND LTD 2012-03-07 CN disclosed
CN-102369230-A Polyester composite for forming thermoset films NISSAN CHEMICAL IND LTD 2012-03-07 CN disclosed
CN-102361932-A Polyester composition for forming thermosetting film NISSAN CHEMICAL IND LTD 2012-02-22 CN disclosed
CN-101679633-A Resin composition for forming heat-cured film NISSAN CHEMICAL IND LTD 2010-03-24 CN disclosed
US-5686191-A POLYIMIDE ADHESIVE, ELASTICITY HITACHI, LTD. (JP) 1997-11-11 US disclosed