Salicyladehyde

Salicyladehyde

SCHEMBL8884631

O=Cc1ccccc1O.O=Cc1ccccc1O.O=Cc1ccccc1O.[Al]

nearest known ligand 0.95

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TRIM24 O15164 1/20 0.95
▸ TRIM33 Q9UPN9 1/20 0.95
▸ ERN1 O75460 5/20 0.62
▸ LMNA P02545 2/20 0.60
▸ MEN1 O00255 1/20 0.60
▸ THRB P10828 1/20 0.60
▸ BLM P54132 1/20 0.60
▸ KMT2A Q03164 1/20 0.60
▸ TDP1 Q9NUW8 1/20 0.60
▸ CDK4 P11802 1/20 0.58
▸ CCND1 P24385 1/20 0.58
▸ NFKB1 P19838 2/20 0.52
▸ JUN P05412 1/20 0.52
▸ NFE2L2 Q16236 1/20 0.52
▸ CA2 P00918 4/20 0.52
▸ CA1 P00915 2/20 0.52
▸ CA4 P22748 1/20 0.50
▸ MAPT P10636 1/20 0.48
▸ TRPA1 O75762 1/20 0.48
▸ ALDH1A1 P00352 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Salicyladehyde SCHEMBL30146932 1.00 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL30574432 1.00 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL901265 0.97 TRIM24 (1.00) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL29386538 0.97 — —
Salicyladehyde SCHEMBL15395 0.97 — —
Salicyladehyde SCHEMBL23628380 0.95 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL6917405 0.95 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL8958321 0.95 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL1845239 0.95 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1
Salicyladehyde SCHEMBL10888961 0.95 TRIM24 (0.95) TRIM24TRIM33ERN1LMNAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-60071669-A — — None — — JP disclosed
JP-58175850-A — — None — — JP disclosed
CN-113631252-B Method for producing and purifying nanodiamond doped with carbon group element 株式会社大赛璐 2025-05-23 — — CN disclosed
CN-110869343-B Compound, latent antioxidant, composition, cured product, and method for producing cured product 株式会社艾迪科 2025-04-25 — — CN disclosed
CN-111511809-B Curing agent composition and resin composition containing the same 赫克塞尔合成有限公司 2024-08-16 — — CN disclosed
CN-118325041-A Curable composition, method for producing cured product, and cured product thereof 株式会社ADEKA 2024-07-12 — — CN disclosed
CN-118185235-A Curable composition, method for producing cured product, and cured product thereof 株式会社ADEKA 2024-06-14 — — CN disclosed
CN-108884298-B Curable composition, method for producing cured product, and cured product thereof 株式会社ADEKA 2024-05-31 — — CN disclosed
CN-115279831-B Composition, cured product, and method for producing cured product 株式会社艾迪科 2024-05-31 — — CN disclosed
CN-114222773-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2024-04-09 — — CN disclosed
EP-0091131-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-07-20 — — EP disclosed
EP-0103305-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1987-07-22 — — EP disclosed
EP-0172330-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1986-02-26 — — EP disclosed
EP-0057018-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1985-06-05 — — EP disclosed
JP-S6071669-A PHOTOSETTING COMPOSITION FOR PROTECTING FACE OF SLOPE TOSHIBA CORP 1985-04-23 — — JP disclosed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 — — US disclosed
US-4479860-A ORGANOALUMINUM COMPOUND AND PEROXYSILYL COMPOUND AS HARDENING CATALYST TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1984-10-30 — — US disclosed
JP-S58175850-A SEALING OF ELECTRONIC PARTS TOSHIBA CORP 1983-10-15 — — JP disclosed
EP-0091131-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1983-10-12 — — EP disclosed
US-4406764-A Photo-curable epoxy resin composition with organic aluminum and α-ketosilyl compounds TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1983-09-27 — — US disclosed
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