Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACMSD | Q8TDX5 | 2/20 | 0.44 |
| ▸ | QDPR | P09417 | 4/20 | 0.37 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.37 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.37 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.37 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.36 |
| ▸ | BIRC5 | O15392 | 2/20 | 0.35 |
| ▸ | BACE1 | P56817 | 2/20 | 0.35 |
| ▸ | NOS3 | P29474 | 2/20 | 0.35 |
| ▸ | NOS1 | P29475 | 2/20 | 0.35 |
| ▸ | NOS2 | P35228 | 2/20 | 0.35 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.34 |
| ▸ | NUDT1 | P36639 | 1/20 | 0.34 |
| ▸ | KMO | O15229 | 1/20 | 0.33 |
| ▸ | NLRP3 | Q96P20 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8897014 | 0.89 | ACMSD (0.44) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL8897907 | 0.87 | ACMSD (0.48) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL7932026 | 0.82 | ACMSD (0.61) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| Orthocresol SCHEMBL15511891 | 0.78 | ACMSD (0.48) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| P-Cresol SCHEMBL15512160 | 0.77 | ACMSD (0.49) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL3357755 | 0.75 | ACMSD (0.53) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL917464 | 0.75 | ACMSD (0.57) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL28454797 | 0.75 | ACMSD (0.57) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL22313839 | 0.75 | ACMSD (0.53) | ACMSDQDPRHDAC4HDAC2HDAC8 | |
| SCHEMBL10890219 | 0.75 | ACMSD (0.57) | ACMSDQDPRHDAC4HDAC2HDAC8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| US-9851638-B2 | Photosensitive polysiloxane composition and uses thereof | CHI MEI CORPORATION (TW) | 2017-12-26 | — | — | US | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| US-20170023860-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF | CHI MEI CORP (TW) | 2017-01-26 | — | — | US | disclosed |
| US-9541832-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2017-01-10 | — | — | US | disclosed |
| US-9422446-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2016-08-23 | — | — | US | disclosed |
| US-9395627-B2 | Positive photosensitive resin composition and method for forming pattern by using the same | CHI MEI CORPORATION | 2016-07-19 | — | — | US | disclosed |
| US-9389509-B2 | Photosensitive polysiloxane composition, protecting film and element having the protecting film | CHI MEI CORPORATION (TW) | 2016-07-12 | — | — | US | disclosed |
| US-20150378256-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME | CHI MEI CORPORATION (TW) | 2015-12-31 | — | — | US | disclosed |
| US-20150376355-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME | CHI MEI CORPORATION (TW) | 2015-12-31 | — | — | US | disclosed |
| US-20140051017-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF | CHI MEI CORPORATION (TW) | 2014-02-20 | — | — | US | disclosed |
| US-20130306970-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2013-11-21 | — | — | US | disclosed |
| US-20130164461-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2013-06-27 | — | — | US | disclosed |
| US-20120328799-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME | CHI MEI CORPORATION (TW) | 2012-12-27 | — | — | US | disclosed |
| US-20120287393-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME | CHI MEI COOPERATION (TW) | 2012-11-15 | — | — | US | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | disclosed |