SCHEMBL890535

SCHEMBL890535

CCCCCCCCN1C(C)(C)CC(OC(=O)CCCCCCCCC(=O)OC2CC(C)(C)N(CCCCCCCC)C(C)(C)C2)CC1(C)C

nearest known ligand 0.55

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.55
SMN1; SMN2 Q16637 1/20 0.40
DGKA P23743 1/20 0.40
PRKCA P17252 6/20 0.39
LMNA P02545 2/20 0.38
PAM P19021 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1949612 1.00 NAAA (0.55) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL11171155 1.00 NAAA (0.55) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL16135402 1.00 NAAA (0.55) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL17296567 1.00 NAAA (0.55) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL411447 0.96 NAAA (0.51) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL11828465 0.96 NAAA (0.49) NAAASMN1; SMN2DGKAPRKCA
SCHEMBL10788456 0.94 NAAA (0.55) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL11845380 0.92 NAAA (0.52) NAAASMN1; SMN2DGKAPRKCALMNA
SCHEMBL14553078 0.91 NAAA (0.46) NAAASMN1; SMN2DGKAPRKCA
SCHEMBL10526052 0.91 NAAA (0.51) NAAASMN1; SMN2DGKAPRKCALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4411432-B1 LENS AND LENS ASSEMBLY SAMSUNG ELECTRO MECH (KR) 2026-04-29 EP disclosed
US-20240264334-A1 LENS AND LENS ASSEMBLY SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2024-08-08 US disclosed
EP-4411432-A1 LENS AND LENS ASSEMBLY Samsung Electro-Mechanics Co., Ltd. (KR) 2024-08-07 EP disclosed
CN-115088105-A Electrode for lithium ion battery and lithium ion battery APB株式会社 2022-09-20 CN disclosed
US-8466483-B2 Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device NITTO DENKO CORPORATION (JP) 2013-06-18 US disclosed
US-20120080705-A1 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME OBTAINED USING THE SAME FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE NITTO DENKO CORPORATION (JP) 2012-04-05 US disclosed