SCHEMBL890787

SCHEMBL890787

CC1(C)CC23OC2(O3)C(CC2CCCCC2)C1(C)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 2/20 0.33
TP53 P04637 1/20 0.33
NFKB1 P19838 1/20 0.33
CYP2C19 P33261 1/20 0.33
THPO P40225 1/20 0.33
STAT6 P42226 1/20 0.33
HIF1A Q16665 1/20 0.33
NPC1 O15118 1/20 0.33
GMNN O75496 1/20 0.33
LMNA P02545 1/20 0.33
MTOR P42345 1/20 0.33
RAB9A P51151 1/20 0.33
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10491938 0.86
SCHEMBL1473747 0.76 SLC1A3 (0.31)
SCHEMBL9717702 0.74
SCHEMBL7700840 0.70 MAPT (0.33)
SCHEMBL2917433 0.68
SCHEMBL15555 0.67 SLC1A3 (0.32)
SCHEMBL8401956 0.65 GRM2 (0.30)
SCHEMBL15739 0.65 MAPK1 (0.31) MAPK1TP53NFKB1CYP2C19THPO
SCHEMBL9067268 0.65
SCHEMBL9256767 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 179 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12049539-B2 Cycloaliphatic amines for epoxy formulations: a novel curing agent for epoxy systems EVONIK OPERATIONS GMBH (DE) 2024-07-30 US claimed
EP-3559077-B1 N-HYDROXYL ETHYL PIPERIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2023-12-06 EP claimed
EP-4219585-A1 MONO-ALKYLATED DIAMINES FOR EPOXY FORMULATIONS: NOVEL CURING AGENTS FOR EPOXY SYSTEMS Evonik Operations GmbH (DE) 2023-08-02 EP claimed
EP-3680270-B1 MONO-ALKYLATED DIAMINES FOR EPOXY FORMULATIONS: NOVEL CURING AGENTS FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2023-07-19 EP claimed
US-11472913-B2 Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems EVONIK OPERATIONS GMBH (DE) 2022-10-18 US claimed
US-20210054134-A1 CYCLOALIPHATIC AMINES FOR EPOXY FORMULATIONS: A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2021-02-25 US claimed
EP-3762443-A1 CYCLOALIPHATIC AMINES FOR EPOXY FORMULATIONS: A NOVEL CURING AGENT FOR EPOXY SYSTEMS Evonik Operations GmbH (DE) 2021-01-13 EP claimed
US-10738147-B2 N-hydroxyl ethyl piperidine (NHEP): a novel curing agent for epoxy systems EVONIK OPERATIONS GMBH (DE) 2020-08-11 US claimed
US-20200223978-A1 MONO-ALKYLATED DIAMINES FOR EPOXY FORMULATIONS: NOVEL CURING AGENTS FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2020-07-16 US claimed
EP-3680270-A1 MONO-ALKYLATED DIAMINES FOR EPOXY FORMULATIONS: NOVEL CURING AGENTS FOR EPOXY SYSTEMS Evonik Operations GmbH (DE) 2020-07-15 EP claimed
EP-3559077-A1 N-HYDXYL ETHYL PIPRIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS Evonik Degussa GmbH (DE) 2019-10-30 EP claimed
WO-2019170563-A1 CYCLOALIPHATIC AMINES FOR EPOXY FORMULATIONS: A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK DEGUSSA GMBH (DE) 2019-09-12 WO claimed
WO-2018118137-A1 N-HYDXYL ETHYL PIPRIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK DEGUSSA GMBH (DE) 2018-06-28 WO claimed
US-20180171067-A1 N-HYDROXYL ETHYL PIPERIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS EVONIK OPERATIONS GMBH (DE) 2018-06-21 US claimed
US-20240327615-A1 SOLUTIONS OF AMINES IN POLYMERIC PHENOLS IN COMBINATION WITH OTHER RESINS EVONIK OPERATIONS GMBH (DE) 2024-10-03 US disclosed
US-20240327567-A1 Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives EVONIK OPERATIONS GMBH (DE) 2024-10-03 US disclosed
US-20240327610-A1 SOLUTIONS OF AMINES IN FUNCTIONAL AND NON-FUNCTIONAL RESINS EVONIK OPERATIONS GMBH (DE) 2024-10-03 US disclosed
US-6153719-A PHOSPHORUS-CONTAINING COMPOUND HAVING AT LEAST ONE P--OH GROUP AND AT LEAST ONE ORGANIC MOIETY CHARACTERIZED BY THE PRESENCE OF AN ETHYLENICALLY UNSATURATED GROUP;PARTICULARLY USEFUL AS A SEALER FOR AN ADHESIVE JOINT. LORD CORPORATION (US) 2000-11-28 US disclosed
WO-2000008086-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD LORD CORPORATION (US) 2000-02-17 WO disclosed
US-5972423-A METHOD FOR REPAIRING SURFACE OF PLASTIC AUTOMOTIVE VEHICLE PART WITHOUT THE USE OF PRIMER COMPRISING APPLYING CURABLE FILLER COMPOSITION THAT INCLUDES AN EPOXY COMPOUND, POLYTHIOL CURING AGE, AND CATALYST; THEN CURING THE COMPOSITION LORD CORPORATION (US) 1999-10-26 US disclosed