⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8154118 | 0.96 | — | — | |
| SCHEMBL1000260 | 0.77 | — | — | |
| Iodide SCHEMBL11862488 | 0.74 | — | — | |
| SCHEMBL10597441 | 0.69 | — | — | |
| SCHEMBL20950 | 0.67 | ALDH1A1 (0.38) | — | |
| SCHEMBL8520803 | 0.65 | — | — | |
| SCHEMBL9643688 | 0.64 | ALDH1A1 (0.35) | — | |
| Water SCHEMBL31312804 | 0.64 | ALDH1A1 (0.35) | — | |
| SCHEMBL8584559 | 0.64 | ALDH1A1 (0.35) | — | |
| Hydrochloric Acid SCHEMBL1893246 | 0.64 | ALDH1A1 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114141615-A | High-quality semiconductor epitaxial wafer and preparation method thereof | 江苏第三代半导体研究院有限公司 | 2022-03-04 | — | — | CN | claimed |
| CN-114121622-A | Substrate pretreatment method and semiconductor epitaxial layer growth method | 江苏第三代半导体研究院有限公司 | 2022-03-01 | — | — | CN | claimed |
| CN-114122204-A | Semiconductor epitaxial wafer and preparation method and application thereof | 江苏第三代半导体研究院有限公司 | 2022-03-01 | — | — | CN | claimed |
| CN-114121621-A | High quality III-V compound substrate and method of making same | 江苏第三代半导体研究院有限公司 | 2022-03-01 | — | — | CN | claimed |
| US-20120083575-A1 | COMB ARCHITECTURE OLEFIN BLOCK COPOLYMERS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-04-05 | — | — | US | claimed |
| US-7858707-B2 | Catalytic olefin block copolymers via polymerizable shuttling agent | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-12-28 | — | — | US | claimed |
| CN-119708381-A | Preparation method of nano silicone rubber core-shell particles and application of nano silicone rubber core-shell particles in 3D printing | 上海信斯帝克新材料有限公司 | 2025-03-28 | — | — | CN | disclosed |
| CN-114141615-A | High-quality semiconductor epitaxial wafer and preparation method thereof | 江苏第三代半导体研究院有限公司 | 2022-03-04 | — | — | CN | disclosed |
| CN-114122204-A | Semiconductor epitaxial wafer and preparation method and application thereof | 江苏第三代半导体研究院有限公司 | 2022-03-01 | — | — | CN | disclosed |
| CN-114121621-A | High quality III-V compound substrate and method of making same | 江苏第三代半导体研究院有限公司 | 2022-03-01 | — | — | CN | disclosed |
| EP-2436703-B1 | Comb architecture olefin block copolymers | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-04-25 | — | — | EP | disclosed |
| US-8907034-B2 | Comb architecture olefin block copolymers | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-12-09 | — | — | US | disclosed |
| EP-1940896-B1 | CATALYTIC OLEFIN BLOCK COPOLYMERS VIA POLYMERIZABLE SHUTTLING AGENT | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-10-22 | — | — | EP | disclosed |
| WO-2007035492-A1 | CATALYTIC OLEFIN BLOCK COPOLYMERS VIA POLYMERIZABLE SHUTTLING AGENT | DOW GLOBAL TECHNOLOGIES INC. (US) | 2007-03-29 | — | — | WO | disclosed |
| US-7166734-B2 | Method for making organometallic compounds | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2007-01-23 | — | — | US | disclosed |
| US-20060115595-A1 | Organometallic compounds | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2006-06-01 | — | — | US | disclosed |
| EP-1645656-A1 | Organometallic compounds suitable for use in vapor deposition processes | Rohm and Haas Electronic Materials, L.L.C. (US) | 2006-04-12 | — | — | EP | disclosed |
| EP-1643547-A1 | Preparation of group 12 and 13 metal compounds having low levels of oxygenated impurities | Rohm and Haas Electronic Materials, L.L.C. (US) | 2006-04-05 | — | — | EP | disclosed |
| US-20060047132-A1 | Method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2006-03-02 | — | — | US | disclosed |
| US-5492734-A | VAPOR DEPOSITION OF METAL FROM ALKYLALUMINUM HYDRIDE | CANON KABUSHIKI KAISHA (JP) | 1996-02-20 | — | — | US | disclosed |