Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11229529 | 0.81 | TSHR (0.32) | TSHRTDP1 | |
| SCHEMBL11572548 | 0.79 | TSHR (0.30) | TSHRTDP1 | |
| SCHEMBL3803581 | 0.76 | — | — | |
| SCHEMBL94905 | 0.73 | — | — | |
| SCHEMBL4550528 | 0.71 | — | — | |
| SCHEMBL9813036 | 0.69 | TSHR (0.39) | TSHRTDP1 | |
| SCHEMBL11302559 | 0.67 | TSHR (0.37) | TSHRTDP1 | |
| SCHEMBL597423 | 0.67 | TSHR (0.37) | TSHRTDP1 | |
| SCHEMBL3615598 | 0.67 | TSHR (0.37) | TSHRTDP1 | |
| SCHEMBL252504 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173048-B2 | Composition for circuit connection film and circuit connection film using the same | CHEIL INDUSTRIES, INC. (KR) | 2012-05-08 | — | — | US | claimed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | claimed |
| CN-112480682-B | Addition-curable silicone composition, cured product thereof, sheet, and optical element | 信越化学工业株式会社 | 2023-02-17 | — | — | CN | disclosed |
| WO-2023008970-A1 | GEL POLYMER ELECTROLYTE AND LITHIUM SECONDARY BATTERY COMPRISING SAME | 주식회사 엘지에너지솔루션 | 2023-02-02 | — | — | WO | disclosed |
| US-9589696-B2 | Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film | CHEIL INDUSTRIES, INC. (KR) | 2017-03-07 | — | — | US | disclosed |
| US-9389338-B2 | Optical member comprising anisotropic conductive film | CHEIL INDUSTRIES, INC. (KR) | 2016-07-12 | — | — | US | disclosed |
| US-9299654-B2 | Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device | CHEIL INDUSTRIES, INC. (KR) | 2016-03-29 | — | — | US | disclosed |
| US-8872357-B2 | Anisotropic conductive film composition and semiconductor device bonded by the same | CHEIL INDUSTRIES, INC. (KR) | 2014-10-28 | — | — | US | disclosed |
| US-8728352-B2 | Electrical connection material and a solar cell including the same | CHEIL INDUSTRIES, INC. (KR) | 2014-05-20 | — | — | US | disclosed |
| US-20130154094-A1 | ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE | CHEIL INDUSTRIES, INC. (KR) | 2013-06-20 | — | — | US | disclosed |
| US-20130119563-A1 | ANISOTROPIC CONDUCTIVE FILM COMPOSITION AND SEMICONDUCTOR DEVICE BONDED BY THE SAME | KUKDO CHEMICAL CO., LTD. (KR) | 2013-05-16 | — | — | US | disclosed |
| US-20120080068-A1 | ELECTRICAL CONNECTION MATERIAL AND A SOLAR CELL INCLUDING THE SAME | KUKDO CHEMICAL CO., LTD. (KR) | 2012-04-05 | — | — | US | disclosed |
| US-7771559-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | disclosed |
| US-7700007-B2 | Anisotropic conductive film forming composition | CHEIL INDUSTRIES, INC. (KR) | 2010-04-20 | — | — | US | disclosed |
| US-7258918-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20070040153-A1 | Film for anisotropic conductivity and electronic circuits and devices using the film | CHEIL INDUSTRIES, INC. (KR) | 2007-02-22 | — | — | US | disclosed |
| US-20060260744-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060148956-A1 | Anisotropic conductive film forming composition | KUKDO CHEMICAL CO., LTD. (KR) | 2006-07-06 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |