SCHEMBL8930752

SCHEMBL8930752

O=C1C=CC(=O)N1c1cccc(C(c2cccc(N3C(=O)C=CC3=O)c2)(C(F)(F)F)C(F)(F)F)c1

nearest known ligand 0.60

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.60
FAAH O00519 5/20 0.60
HSP90AA1 P07900 3/20 0.51
ALDH1A1 P00352 1/20 0.50
PKM P14618 1/20 0.50
HTT P42858 1/20 0.50
ATM Q13315 1/20 0.50
HPN P05981 1/20 0.46
AR P10275 1/20 0.43
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9578282 0.88 MGLL (0.53) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL3180022 0.86 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL332102 0.81 MGLL (0.53) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30170475 0.81 MGLL (0.53) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL28385993 0.79 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1155772 0.78 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL8999913 0.77 CCR6 (0.41) MGLLFAAHHSP90AA1
SCHEMBL14150139 0.77 MGLL (0.65) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL94730 0.77 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1838889 0.77 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9003044-A None JP disclosed
JP-H093044-A FLUORINE-CONTAINING BISMALEIMIDE COMPOUND AND THERMOSETTING RESIN COMPOSITION TOSHIBA CORP 1997-01-07 JP disclosed
US-5194518-A Polyimides, prepregs, fluoropolymers NITTO DENKO CORPORATION (JP) 1993-03-16 US disclosed
EP-0422379-A2 Thermosetting resin composition, resin sheet, prepreg and laminated sheet NITTO DENKO CORPORATION (JP) 1991-04-17 EP disclosed