SCHEMBL894465

SCHEMBL894465

OCC1C(CO)C2CC1C1CCCC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14890041 0.84
SCHEMBL10981383 0.80 UGT2B7 (0.31)
SCHEMBL5326361 0.79
SCHEMBL16448668 0.79
SCHEMBL22027140 0.78
SCHEMBL5568212 0.78
SCHEMBL7081832 0.77 TDP1 (0.30)
SCHEMBL12707481 0.77 TDP1 (0.30)
SCHEMBL12707568 0.77 TDP1 (0.30)
SCHEMBL18419251 0.73 TSHR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3046975-B1 HYDROXYL GROUP-CONTAINING SILICON-POLYESTER-ACRYLATE BINDERS EVONIK DEGUSSA GMBH (DE) 2017-05-24 EP claimed
EP-3046980-A1 ROOM TEMPERATURE-CURING SILICONE-POLYESTER BINDER Evonik Degussa GmbH (DE) 2016-07-27 EP claimed
EP-3046975-A1 HYDROXYL GROUP-CONTAINING SILICON-POLYESTER-ACRYLATE BINDERS Evonik Degussa GmbH (DE) 2016-07-27 EP claimed
WO-2015039838-A1 ROOM TEMPERATURE-CURING SILICONE-POLYESTER BINDER EVONIK INDUSTRIES AG (DE) 2015-03-26 WO claimed
WO-2015039837-A1 HYDROXYL GROUP-CONTAINING SILICON-POLYESTER-ACRYLATE BINDERS EVONIK INDUSTRIES AG (DE) 2015-03-26 WO claimed
EP-2623087-A2 Dental composite materials containing tricyclic plasticisers VOCO GmbH (DE) 2013-08-07 EP claimed
US-12318459-B2 Thermoactive dental composite composition VOCO GMBH (DE) 2025-06-03 US disclosed
US-20240293290-A1 THERMOACTIVE DENTAL COMPOSITE COMPOSITION VOCO GMBH (DE) 2024-09-05 US disclosed
EP-4417180-A2 THERMO-ACTIVE COMPOSITE DENTAL COMPOSITION VOCO GmbH (DE) 2024-08-21 EP disclosed
EP-3810064-B1 THERMOACTIVE DENTAL COMPOSITE COMPOSITION VOCO GMBH (DE) 2024-05-29 EP disclosed
US-11944692-B2 Thermoactive dental composite composition VOCO GMBH (DE) 2024-04-02 US disclosed
EP-3775073-B1 BICOMPONENT SYSTEM WITH IMPROVED ADHESION COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG (DE) 2022-01-12 EP disclosed
EP-3775073-A1 TWO-COMPONENT SYSTEM HAVING IMPROVED ADHESION Covestro Intellectual Property GmbH & Co. KG (DE) 2021-02-17 EP disclosed
WO-2015039837-A1 HYDROXYL GROUP-CONTAINING SILICON-POLYESTER-ACRYLATE BINDERS EVONIK INDUSTRIES AG (DE) 2015-03-26 WO disclosed
US-20120082958-A1 Composite Material Comprising a Monomer with a Polyalicyclic Structure Element VOCO GMBH (DE) 2012-04-05 US disclosed
EP-2311896-A1 POLYESTERS, POLYESTER COMPOSITIONS, ADHESIVE COMPOSITIONS, ADHESIVE LAYERS AND ADHESIVE SHEETS Nitto Denko Corporation (JP) 2011-04-20 EP disclosed
US-7691784-B2 Receptor layer forming resin for thermal transfer image receptor sheet and thermal transfer image receptor sheet using the same DAI NIPPON PRINTING CO., LTD. (JP) 2010-04-06 US disclosed
EP-1112995-B1 ALICYCLIC COMPOUNDS AND CURABLE RESIN COMPOSITION NISSAN CHEMICAL IND LTD (JP) 2007-04-11 EP disclosed
US-20060229202-A1 Receptor layer forming resin for thermal transfer image receptor sheet and thermal transfer image receptor sheet using the same DAI NIPPON PRINTING CO., LTD. (JP) 2006-10-12 US disclosed
JP-2002179620-A METHOD FOR PRODUCING ALICYCLIC MONOACRYLATE COMPOUND NISSAN CHEM IND LTD 2002-06-26 JP disclosed