SCHEMBL894876

SCHEMBL894876

Nc1cccc(-c2cc(N)ccc2Sc2ccc(N)cc2-c2cccc(N)c2)c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.48
MAP4K4 O95819 3/20 0.46
RECQL P46063 2/20 0.42
CASP1 P29466 2/20 0.42
CYP3A4 P08684 1/20 0.42
MEN1 O00255 3/20 0.40
PSIP1 O75475 1/20 0.40
AXL P30530 1/20 0.40
MKNK1 Q9BUB5 1/20 0.40
MKNK2 Q9HBH9 1/20 0.40
MAPT P10636 4/20 0.39
BRD4 O60885 2/20 0.39
ITGB2 P05107 1/20 0.39
ICAM1 P05362 1/20 0.39
ITGAL P20701 1/20 0.39
KDM4E B2RXH2 3/20 0.39
ALDH1A1 P00352 3/20 0.39
HPGD P15428 3/20 0.39
LMNA P02545 2/20 0.39
KMT2A Q03164 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3804493 0.88 MAPT (0.51) MAOAMAP4K4CYP3A4MEN1MAPT
SCHEMBL3789663 0.85 MAOA (0.45) MAOAMAP4K4RECQLCASP1CYP3A4
SCHEMBL1270617 0.84 MAOA (0.54) MAOAMAP4K4RECQLCASP1CYP3A4
SCHEMBL3785536 0.80 MAOA (0.41) MAOAMAP4K4RECQLCASP1CYP3A4
SCHEMBL25632076 0.79 MAOA (0.56) MAOAMAP4K4RECQLCASP1CYP3A4
SCHEMBL3792888 0.77 HPGD (0.56) MAOACYP3A4MEN1MAPTBRD4
SCHEMBL2478623 0.77 MAOA (0.54) MAOAMAP4K4RECQLCASP1CYP3A4
SCHEMBL31457327 0.76 PDE7A (0.53) MAOARECQLCYP3A4MEN1MAPT
Hydrochloric Acid SCHEMBL6574391 0.75 MAOA (0.52) MAOAMAP4K4RECQLCASP1CYP3A4
SCHEMBL3790028 0.74 MAOA (0.52) MAOAMAP4K4MEN1MAPTBRD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 174 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5288843-A Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility MITSUI TOATSU CHEMICALS, INC. (JP) 1994-02-22 US claimed
US-20240182765-A1 POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2024-06-06 US disclosed
EP-3756892-B1 INKJET HEAD AND METHOD FOR PRODUCING SAME KONICA MINOLTA INC (JP) 2023-08-23 EP disclosed
WO-2022202416-A1 POLYAMIDE ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE 三井化学株式会社 2022-09-29 WO disclosed
US-11420440-B2 Inkjet head and method for producing same Konica Minolta, Inc. (JP) 2022-08-23 US disclosed
US-10988647-B2 Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same MITSUI CHEMICALS, INC. (JP) 2021-04-27 US disclosed
US-20210016572-A1 INKJET HEAD AND METHOD FOR PRODUCING SAME Konica Minolta, Inc. (JP) 2021-01-21 US disclosed
EP-3756892-A1 INKJET HEAD AND METHOD FOR PRODUCING SAME KONICA MINOLTA, INC. (JP) 2020-12-30 EP disclosed
US-20200377772-A1 SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME MITSUI CHEMICALS, INC. (JP) 2020-12-03 US disclosed
US-10716203-B2 Adhesive film and flexible metal laminate AGC Inc. (JP) 2020-07-14 US disclosed
US-5041520-A Process for preparing polyimide having excellent high temperature stability MITSUI TOATSU CHEMICALS, INC. (JP) 1991-08-20 US disclosed
EP-0431789-A2 Preparation process of polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-06-12 EP disclosed
EP-0430430-A2 Polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-06-05 EP disclosed
EP-0430640-A1 Polyimide based resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-06-05 EP disclosed
US-5010168-A Heat and chemical stability AKZO NV (NL) 1991-04-23 US disclosed
US-4994544-A Imidation of polyamic acids MITSUI TOATSU CHEMICALS, INC. (JP) 1991-02-19 US disclosed
EP-0367482-A1 Polyimides and process for the preparation thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-05-09 EP disclosed
US-4908264-A Composites comprising an aramid matrix AKZO N.V. (NL) 1990-03-13 US disclosed
EP-0350203-A2 Process for preparing polyimide having excellent high temperature stability MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-01-10 EP disclosed
EP-0307993-A1 Composites comprising an aramid matrix AKZO N.V. (NL) 1989-03-22 EP disclosed