Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRM2 | P08172 | 1/20 | 0.33 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.33 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.33 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2949975 | 0.84 | CHRM2 (0.32) | CHRM2CHRM4CHRM5CHRM3 | |
| SCHEMBL7527770 | 0.78 | ALDH1A1 (0.30) | — | |
| SCHEMBL11237177 | 0.75 | — | — | |
| SCHEMBL11241581 | 0.74 | ALDH1A1 (0.32) | — | |
| SCHEMBL2007023 | 0.74 | CHRM2 (0.32) | CHRM2CHRM4CHRM5CHRM3 | |
| SCHEMBL27008270 | 0.73 | CHRM2 (0.33) | CHRM2CHRM4CHRM5CHRM3 | |
| SCHEMBL3427180 | 0.71 | — | — | |
| SCHEMBL995097 | 0.68 | — | — | |
| SCHEMBL3693193 | 0.67 | CHRM2 (0.47) | CHRM2CHRM4CHRM5CHRM3 | |
| SCHEMBL996089 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0384036-B1 | Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste | HITACHI CHEMICAL CO LTD (JP) | 1996-05-01 | — | — | EP | disclosed |
| US-5164816-A | Polyamides, polyimides | HITACHI CHEMICAL CO., LTD. (JP) | 1992-11-17 | — | — | US | disclosed |
| US-5087658-A | HEAT-RESISTANT RESIN PASTE AND INTEGRATED CIRCUIT DEVICE PRODUCED BY USING THE HEAT-RESISTANT RESIN PASTE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1992-02-11 | — | — | US | disclosed |
| EP-0384036-A2 | Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste | Hitachi Chemical Co., Ltd. (JP) | 1990-08-29 | — | — | EP | disclosed |