SCHEMBL8962571

SCHEMBL8962571

CC(C)CCCC(C)C.[Zn]

nearest known ligand 0.67

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.67
BLM P54132 1/20 0.43
PTPN1 P18031 2/20 0.37
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
CYP3A4 P08684 1/20 0.37
ALOX15 P16050 1/20 0.37
CA1 P00915 2/20 0.33
TSHR P16473 1/20 0.33
ALDH1A1 P00352 2/20 0.32
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL42290 0.95
SCHEMBL16469538 0.95
SCHEMBL28389547 0.91 LMNA (0.67) LMNABLMPTPN1MEN1KMT2A
SCHEMBL108076 0.86 LMNA (0.71) LMNABLMPTPN1MEN1KMT2A
SCHEMBL538230 0.84 LMNA (0.93) LMNABLMPTPN1MEN1KMT2A
SCHEMBL20928 0.84 LMNA (0.93) LMNABLMPTPN1MEN1KMT2A
SCHEMBL29662067 0.84 LMNA (0.93) LMNABLMPTPN1MEN1KMT2A
SCHEMBL8672325 0.84 LMNA (0.93) LMNABLMPTPN1MEN1KMT2A
SCHEMBL7580335 0.82 LMNA (0.67) LMNABLMPTPN1MEN1KMT2A
SCHEMBL21925059 0.82 LMNA (0.67) LMNABLMPTPN1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5292364-A Containing organometallic compound, organic polymer and below a specified moisture content; bonding substrates TOAGOSEI CHEMICA INDUSTRY CO., LTD. (JP) 1994-03-08 US claimed
EP-0129069-B1 PROCESS FOR BONDING NON-POLAR OR HIGHLY CRYSTALLINE RESIN SUBSTRATS TO EACH OTHER OR TO ANOTHER MATERIAL TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-21 EP claimed
EP-0420293-A1 Primer TOAGOSEI CO., LTD. (JP) 1991-04-03 EP claimed
US-4818325-A BLEND WITH ORGANOMETALLIC COMPOUND AND ORGANIC POLYMERS TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1989-04-04 US claimed
EP-0129069-A2 Process for bonding non-polar or highly crystalline resin substrats to each other or to another material TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1984-12-27 EP claimed
WO-2024030592-A1 PROCESSES FOR PRODUCING RADICALLY-FUNCTIONALIZED PIBSA PRODUCT DERIVATIVES AND COMPOSITIONS COMPRISING SAME THE LUBRIZOL CORPORATION (US) 2024-02-08 WO disclosed
EP-0695798-A2 Lubricating compositions, concentrates, and greases containing the combination of an organic polysulfide and an overbased composition or a phosphorus or boron compound THE LUBRIZOL CORPORATION (US) 1996-02-07 EP disclosed
EP-0420293-B1 Primer TOAGOSEI CO LTD (JP) 1995-12-06 EP disclosed
US-5292364-A Containing organometallic compound, organic polymer and below a specified moisture content; bonding substrates TOAGOSEI CHEMICA INDUSTRY CO., LTD. (JP) 1994-03-08 US disclosed
US-5110392-A PRIMER COMPOSITION CONTAINING AN ORGANOMETALLIC COMPOUND FOR BINDING SUBSTRATES WITH A CYANOCRYLATE ADHESIVE TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1992-05-05 US disclosed
EP-0129069-B1 PROCESS FOR BONDING NON-POLAR OR HIGHLY CRYSTALLINE RESIN SUBSTRATS TO EACH OTHER OR TO ANOTHER MATERIAL TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-21 EP disclosed
EP-0420293-A1 Primer TOAGOSEI CO., LTD. (JP) 1991-04-03 EP disclosed
US-4822426-A BLEND OF ORGANOMETALLIC COMPOUNDS RESIN AND FLUORINE COMPOUND TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1989-04-18 US disclosed
US-4818325-A BLEND WITH ORGANOMETALLIC COMPOUND AND ORGANIC POLYMERS TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1989-04-04 US disclosed
EP-0129069-A2 Process for bonding non-polar or highly crystalline resin substrats to each other or to another material TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1984-12-27 EP disclosed