⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8025781 | 0.74 | — | — | |
| SCHEMBL926380 | 0.67 | — | — | |
| SCHEMBL27980324 | 0.66 | — | — | |
| SCHEMBL2030787 | 0.63 | — | — | |
| SCHEMBL2030412 | 0.62 | — | — | |
| SCHEMBL8962854 | 0.62 | — | — | |
| SCHEMBL8759409 | 0.60 | — | — | |
| SCHEMBL10013713 | 0.60 | — | — | |
| SCHEMBL8200527 | 0.59 | — | — | |
| SCHEMBL23992282 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0467561-B1 | Photosensitive resin composition for forming a polyimide film pattern | TOSHIBA KK (JP) | 1995-10-18 | — | — | EP | claimed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-5518864-A | PHOTOSENSITIVE, QUINONE DIAZIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-05-21 | — | — | US | disclosed |
| EP-0137655-B1 | RADIATION-SENSITIVE POLYMER COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 1988-12-28 | — | — | EP | disclosed |
| US-4783391-A | Radiation-sensitive polyamide polymer composition with anthraquinone monoazide | TORAY INDUSTRIES, INC. (JP) | 1988-11-08 | — | — | US | disclosed |
| EP-0119719-B1 | RADIATION SENSITIVE POLYMER COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 1987-05-06 | — | — | EP | disclosed |
| US-4608333-A | INCREASED PHOTOSENSITIVITY BY INCLUDING AN AROMATIC SECONDARY OR TERTIARY AMINE WITH AN ACRYLIC MONOMER AND A POLYIMIDE-CURING POLYAMIDE | TORAY INDUSTRIES, INC. (JP) | 1986-08-26 | — | — | US | disclosed |
| EP-0137655-A2 | Radiation-sensitive polymer composition | TORAY INDUSTRIES, INC. (JP) | 1985-04-17 | — | — | EP | disclosed |
| EP-0119719-A1 | Radiation sensitive polymer composition | TORAY INDUSTRIES, INC. (JP) | 1984-09-26 | — | — | EP | disclosed |