SCHEMBL8962854

SCHEMBL8962854

CC1(C)O[Si](C)(C)CCC1(CCCN)CCCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2030791 0.71
SCHEMBL8025784 0.69
SCHEMBL689258 0.63
SCHEMBL926380 0.62
SCHEMBL11647862 0.62
SCHEMBL8962844 0.62
SCHEMBL272918 0.61
SCHEMBL8200530 0.61
SCHEMBL21641959 0.61
SCHEMBL3625957 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116560188-B Photosensitive resin composition, photosensitive resin sheet and application thereof 波米科技有限公司 2024-02-13 CN claimed
CN-116560188-A Photosensitive resin composition, photosensitive resin sheet and application thereof 波米科技有限公司 2023-08-08 CN claimed
CN-115639724-B Preparation method and application of photosensitive resin composition 波米科技有限公司 2023-08-08 CN claimed
CN-115639724-A Preparation method and application of photosensitive resin composition 波米科技有限公司 2023-01-24 CN claimed
EP-0467561-B1 Photosensitive resin composition for forming a polyimide film pattern TOSHIBA KK (JP) 1995-10-18 EP claimed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
CN-116560188-B Photosensitive resin composition, photosensitive resin sheet and application thereof 波米科技有限公司 2024-02-13 CN disclosed
CN-108165281-B Liquid crystal aligning agent and preparation method and application thereof 常州市尚科新材料有限公司 2023-11-24 CN disclosed
CN-115639724-B Preparation method and application of photosensitive resin composition 波米科技有限公司 2023-08-08 CN disclosed
CN-116560188-A Photosensitive resin composition, photosensitive resin sheet and application thereof 波米科技有限公司 2023-08-08 CN disclosed
CN-116116235-B Reverse osmosis membrane with self-healing function and preparation method thereof 中复新水源科技有限公司 2023-08-01 CN disclosed
CN-116116235-A Reverse osmosis membrane with self-healing function and preparation method thereof 中复新水源科技有限公司 2023-05-16 CN disclosed
CN-106751826-A A kind of activeness and quietness self-curing hard polyimide foaming and preparation method thereof 自贡中天胜新材料科技有限公司 2017-05-31 CN disclosed
EP-3126415-A1 SILICONE ACRYLAMIDE COPOLYMER Johnson & Johnson Vision Care Inc. (US) 2017-02-08 EP disclosed
WO-2015153403-A1 SILICONE ACRYLAMIDE COPOLYMER JOHNSON & JOHNSON VISION CARE, INC. (US) 2015-10-08 WO disclosed
US-5518864-A PHOTOSENSITIVE, QUINONE DIAZIDE KABUSHIKI KAISHA TOSHIBA (JP) 1996-05-21 US disclosed
EP-0137655-B1 RADIATION-SENSITIVE POLYMER COMPOSITION TORAY INDUSTRIES, INC. (JP) 1988-12-28 EP disclosed
US-4783391-A Radiation-sensitive polyamide polymer composition with anthraquinone monoazide TORAY INDUSTRIES, INC. (JP) 1988-11-08 US disclosed
EP-0119719-B1 RADIATION SENSITIVE POLYMER COMPOSITION TORAY INDUSTRIES, INC. (JP) 1987-05-06 EP disclosed
US-4608333-A INCREASED PHOTOSENSITIVITY BY INCLUDING AN AROMATIC SECONDARY OR TERTIARY AMINE WITH AN ACRYLIC MONOMER AND A POLYIMIDE-CURING POLYAMIDE TORAY INDUSTRIES, INC. (JP) 1986-08-26 US disclosed