Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 2/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | NAAA | Q02083 | 1/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27401938 | 0.83 | CYP19A1 (0.34) | — | |
| SCHEMBL4134537 | 0.75 | CYP2C19 (0.36) | EPHX1CYP2C19NAAANPC1POLB | |
| SCHEMBL27744349 | 0.73 | EPHX1 (0.34) | EPHX1CYP2C19NAAAHTTCHRM3 | |
| SCHEMBL28603032 | 0.72 | ADAM17 (0.35) | EPHX1 | |
| SCHEMBL14967398 | 0.72 | EPHX1 (0.43) | EPHX1CYP2C19NAAAHTTCHRM3 | |
| SCHEMBL14967075 | 0.70 | EPHX1 (0.40) | EPHX1CYP2C19NAAAHTTCHRM3 | |
| SCHEMBL27744126 | 0.70 | EPHX1 (0.36) | EPHX1CYP2C19NAAAHTTCHRM3 | |
| SCHEMBL14967960 | 0.69 | EPHX1 (0.41) | EPHX1CYP2C19NAAAHTTCHRM3 | |
| SCHEMBL13608924 | 0.69 | EPHX1 (0.35) | EPHX1CYP2C19NAAAHTTCHRM3 | |
| SCHEMBL28013258 | 0.69 | EPHX1 (0.39) | EPHX1CYP2C19NAAAHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-4481651-B2 | — | — | 2010-06-16 | — | — | JP | claimed |
| EP-1527147-B1 | TWO PART EPOXIDE ADHESIVE WITH IMPROVED STRENGTH | HENKEL AG & CO KGAA (DE) | 2010-03-10 | — | — | EP | claimed |
| JP-4352126-B2 | — | — | 2009-10-28 | — | — | JP | claimed |
| EP-1816175-B1 | Thermal interface material | HENKEL AG & CO KGAA (DE) | 2009-10-14 | — | — | EP | claimed |
| EP-1818351-B1 | Underfill encapsulant for wafer packaging and method for its application | HENKEL AG & CO KGAA (DE) | 2009-06-24 | — | — | EP | claimed |
| JP-4276085-B2 | — | — | 2009-06-10 | — | — | JP | claimed |
| US-20080039555-A1 | Thermally conductive material | HENKEL AG & CO. KGAA (DE) | 2008-02-14 | — | — | US | claimed |
| EP-1887033-A1 | Thermally conductive material | National Starch and Chemical Investment Holding Corporation (US) | 2008-02-13 | — | — | EP | claimed |
| US-20070287775-A1 | Low viscosity curable compositions | HENKEL AG & CO. KGAA (DE) | 2007-12-13 | — | — | US | claimed |
| EP-1865011-A1 | Low viscosity curable compositions | National Starch and Chemical Investment Holding Corporation (US) | 2007-12-12 | — | — | EP | claimed |
| US-6624216-B2 | Contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst; to protect and reinforce interconnections between an electronic component and a substrate in a microelectronic device | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION | 2003-09-23 | — | — | US | claimed |
| WO-2003075338-A1 | UNDERFILL ENCAPSULANT FOR WAFER PACKAGING AND METHOD FOR ITS APPLICATION | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2003-09-12 | — | — | WO | claimed |
| WO-2003075339-A1 | B-STAGEABLE UNDERFILL ENCAPSULANT AND METHOD FOR ITS APPLICATION | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2003-09-12 | — | — | WO | claimed |
| US-20030171456-A1 | Underfill encapsulant for wafer packaging and method for its application | HENKEL AG & CO. KGAA (DE) | 2003-09-11 | — | — | US | claimed |
| US-20030164555-A1 | B-stageable underfill encapsulant and method for its application | NATIONAL STARCH AND CHEMICAL INVESTMENT | 2003-09-04 | — | — | US | claimed |
| US-20030162911-A1 | No flow underfill composition | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION | 2003-08-28 | — | — | US | claimed |
| WO-2003064493-A1 | NO FLOW UNDERFILL COMPOSITION | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2003-08-07 | — | — | WO | claimed |
| US-20030149135-A1 | Contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst; to protect and reinforce interconnections between an electronic component and a substrate in a microelectronic device | HENKEL AG & CO. KGAA (DE) | 2003-08-07 | — | — | US | claimed |
| WO-2003065447-A2 | NO-FLOW UNDERFILL ENCAPSULANT | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2003-08-07 | — | — | WO | claimed |
| US-6380322-B1 | CROSSLINKED BLEND | GEORGIA TECH RESEARCH CORPORATION | 2002-04-30 | — | — | US | claimed |