SCHEMBL896450

SCHEMBL896450

[CH2]COC(COCC)(OC=C)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21625266 0.92
SCHEMBL4910438 0.89
SCHEMBL11507572 0.88
SCHEMBL895709 0.84 THRB (0.30)
SCHEMBL21625267 0.83
SCHEMBL2170771 0.83
SCHEMBL895996 0.76
SCHEMBL17133771 0.74
SCHEMBL22127702 0.73
SCHEMBL2170883 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 231 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170002221-A1 UV CURABLE INK JET RECORDING INK COMPOSITION, INK CONTAINER AND INK JET RECORDING APPARATUS SEIKO EPSON CORPORATION (JP) 2017-01-05 US claimed
US-12036806-B2 Ink jet recording method and ink jet recording apparatus SEIKO EPSON CORPORATION (JP) 2024-07-16 US disclosed
WO-2024135086-A1 PHOTOCURABLE COMPOSITION, UNDERCOAT LAYER, LAMINATE AND DISPLAY DEVICE 株式会社ダイセル 2024-06-27 WO disclosed
US-12006440-B2 Radiation curable inkjet inks for interior decoration AGFA NV (BE) 2024-06-11 US disclosed
WO-2024111420-A1 ALKALI-SOLUBLE RESIN, LIGHT-SENSITIVE RESIN COMPOSITION, METHODS RESPECTIVELY FOR PRODUCING THOSE, AND USE OF THOSE 株式会社日本触媒 2024-05-30 WO disclosed
US-11981823-B2 Radiation-curable ink jet composition and ink jet method SEIKO EPSON CORPORATION (JP) 2024-05-14 US disclosed
US-11952501-B2 Ink set and ink jet recording method SEIKO EPSON CORPORATION (JP) 2024-04-09 US disclosed
WO-2024053609-A1 ALKALI-SOLUBLE RESIN, METHOD FOR PRODUCING SAME, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, MEMBER FOR DISPLAY DEVICE, AND DISPLAY DEVICE 株式会社日本触媒 2024-03-14 WO disclosed
US-20240059823-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF CANON KK (JP) 2024-02-22 US disclosed
US-20240059075-A1 PHOTO-CURABLE INK JET INK SET AND INK JET RECORDING METHOD USING THE SAME SEIKO EPSON CORPORATION (JP) 2024-02-22 US disclosed
EP-2348081-A1 ADHESIVE COMPOSITION AND OPTICAL MEMBER Cheil Industries Inc. (KR) 2011-07-27 EP disclosed
EP-1505090-B1 REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION NIPPON CATALYTIC CHEM IND (JP) 2010-03-31 EP disclosed
EP-1967561-A1 COATING AGENT FOR PLASTIC LABEL, AND PLASTIC LABEL Fuji Seal International, Inc. (JP) 2008-09-10 EP disclosed
EP-1308434-B1 (Meth)acryloyl group-containing compound and method for producing the same NIPPON CATALYTIC CHEM IND (JP) 2006-03-15 EP disclosed
US-6887946-B2 (Meth) acryloyl group-containing compound and method for producing the same NIPPON SHOKUBAI CO., LTD. (JP) 2005-05-03 US disclosed
EP-1505090-A1 REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION Nippon Shokubai Co., Ltd. (JP) 2005-02-09 EP disclosed
US-6767980-B2 ACTIVATED ENERGY RAY-CURABLE INK COMPOSITION FOR INK-JET PRINTING; VINYL ETHER GROUP-CONTAINING (METH)ACRYLIC ESTER NIPPON SHOKUBAI CO., LTD. (JP) 2004-07-27 US disclosed
US-20030199655-A1 Reactive diluent and curable resin composition NIPPON SHOKUBAI CO., LTD. 2003-10-23 US disclosed
US-20030134926-A1 (Meth) acryloyl group-containing compound and method for producing the same NIPPON SHOKUBAI CO., LTD. 2003-07-17 US disclosed
EP-1308434-A1 (Meth)acryloyl group-containing compound and method for producing the same Nippon Shokubai Co., Ltd. (JP) 2003-05-07 EP disclosed